公开(公告)号：US20230018891A1

公开(公告)日：2023-01-19

申请号：US17374189

申请日：2021-07-13

Applicant: Applied Materials, Inc.

Inventor： Xiaozhou CHE ,  Graeme Jamieson SCOTT ,  Richard Gustav HAGBORG ,  Alan H. OUYE ,  Nelson A. YEE

IPC: G01B17/02 ,  H01L21/66

Abstract: One or more embodiments described herein generally relate to methods and systems for monitoring film thickness using a sensor assembly. In embodiments described herein, a process chamber having a chamber body, a substrate support disposed in the chamber body, a lid disposed over the chamber body, and a sensor assembly coupled to the chamber body at a lower portion of the sensor assembly. The sensor assembly is coupled to the lid at an upper portion of the sensor assembly. The sensor assembly includes one or more apertures disposed through one or more sides of the sensor assembly, and the one or more sensors are disposed in the sensor assembly through the one or more of the apertures.