公开(公告)号：US12033874B2

公开(公告)日：2024-07-09

申请号：US17011781

申请日：2020-09-03

Applicant: Applied Materials, Inc.

Inventor： Shu-Kwan Danny Lau ,  Adel George Tannous ,  Patrick C. Genis ,  Zhiyuan Ye

IPC: H01L21/67

CPC classification number: H01L21/67115

Abstract: An apparatus for heating a substrate within a thermal processing chamber is disclosed. The apparatus includes a chamber body, a gas inlet, a gas outlet, an upper window, a lower window, a substrate support, and an upper heating device. The upper heating device is a laser heating device and includes one or more laser assemblies. The laser assemblies include light sources, a cooling plate, optical fibers, and irradiation windows.