公开(公告)号：US20250062104A1

公开(公告)日：2025-02-20

申请号：US18234731

申请日：2023-08-16

Applicant: Applied Materials, Inc.

Inventor： Sudhir R. GONDHALEKAR ,  Peter LAI ,  Suresh KARAVINAKOPPA ,  Pavankumar Ramanand HARAPANHALLI

IPC: H01J37/32 ,  H03H7/38

Abstract: Embodiments of substrate supports for use in process chambers are provided herein. In some embodiments, a substrate support for a process chamber includes: a pedestal having a support surface for supporting a substrate, one or more heating elements disposed therein, and an RF electrode disposed therein; a hollow shaft coupled to a lower surface of the pedestal; and an RF rod extending through the hollow shaft and having an upper portion that includes an upper end coupled to the RF electrode, wherein the upper end of the RF rod has at least one of (a) a cross sectional width that is wider than a lower portion of the RF rod or (b) one or more slots.

公开(公告)号：US20240170311A1

公开(公告)日：2024-05-23

申请号：US17989980

申请日：2022-11-18

Applicant: Applied Materials, Inc.

Inventor： Ralph P. ANTONIO ,  Lee Guan TAY ,  Peter LAI ,  Sudhir R. GONDHALEKAR ,  Tzu-Fang HUANG ,  Jeffrey HUDGENS

IPC: H01L21/67 ,  B25J9/16 ,  B25J11/00 ,  B25J13/08 ,  B25J19/02 ,  G01S17/89 ,  H01L21/677

CPC classification number: H01L21/67259 ,  B25J9/161 ,  B25J11/0095 ,  B25J13/088 ,  B25J19/021 ,  G01S17/89 ,  H01L21/67742

Abstract: Methods and apparatus for processing a substrate are provided herein. For example, an apparatus for processing a substrate comprises a transfer robot configured to position a substrate on a substrate support disposed within an interior of a processing chamber configured to process the substrate and a sensor disposed on the transfer robot, operably connected to a controller of the processing chamber, and configured with an angle of view to provide in-situ continuous closed loop feedback relating to spatial information of the interior of the processing chamber to the controller.