公开(公告)号：US20240144464A1

公开(公告)日：2024-05-02

申请号：US17976726

申请日：2022-10-28

Applicant: Applied Materials, Inc.

Inventor： Chandrani Roy Chowdhury ,  Sanjiv Mittal ,  James Henry Gardner, Jr. ,  Mohana Roy Chowdhury ,  Sachin Dangayach ,  Victor Rotion D'souza ,  Rajesh Kumar Singal ,  Rajesh Naidu Penagalapati ,  Priyanka Jain

IPC: G06T7/00 ,  G01N21/88 ,  G06V10/764

CPC classification number: G06T7/0008 ,  G01N21/8851 ,  G06V10/764 ,  G01N2021/8861 ,  G06T2207/20081

Abstract: A method includes obtaining, by a processing device, data indicative of locations of defects of a substrate. The method further includes generating an image indicating the locations of the defects. The method further includes providing the image indicating the locations of the defects to a trained machine learning model. The method further includes obtaining, as output from the trained machine learning model, a classification of the locations of the defects. The method further includes performing a corrective action in view of the output from the trained machine learning model.