公开(公告)号：US20040200733A1

公开(公告)日：2004-10-14

申请号：US10837955

申请日：2004-05-03

Applicant: Applied Materials, Inc.

Inventor： Ralph Wadensweiler ,  Alain Duboust ,  Liang-Yuh Chen ,  Manoocher Birang ,  Ratson Morad ,  Paul D. Butterfield

IPC: B24B001/00

CPC classification number: B23H5/08 ,  C25F7/00

Abstract: A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a conductive polishing pad and an electrode having a membrane disposed therebetween. The membrane is orientated relative the conductive pad in a manner that facilitates removal of entrained gas from electrolyte flowing towards the conductive pad. The apparatus may be part of an electro-chemical polishing station that may optionally be part of a system that includes chemical mechanical polishing stations.

Abstract translation: 提供了一种用于抛光衬底表面的方法和装置。 一方面，用于抛光衬底的装置包括导电抛光垫和在其间设置有膜的电极。 膜以相对于导电垫的方向定向，以便于从电解液中流出的夹带气体去除导电垫。 该设备可以是电化学抛光站的一部分，其可以可选地是包括化学机械抛光站的系统的一部分。

公开(公告)号：US20040134792A1

公开(公告)日：2004-07-15

申请号：US10608513

申请日：2003-06-26

Applicant: Applied Materials, Inc.

Inventor： Paul D. Butterfield ,  Liang-Yuh Chen ,  Yongqi Hu ,  Antoine P. Manens ,  Rashid Mavliev ,  Stan D. Tsai ,  Feng Q. Liu ,  Ralph Wadensweiler

IPC: B23H003/00

CPC classification number: H01L21/32125 ,  B23H5/08 ,  B23H5/10 ,  B24B37/046 ,  B24B37/11 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24B53/017

Abstract: Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupled to a second end of the housing. The contact element electrically couples the adapter and the ball with is retained in the housing between seat and the adapter.

Abstract translation: 提供球组件的实施例。 在一个实施例中，球组件包括壳体，球，导电适配器和接触元件。 壳体具有延伸到内部通道的第一端的环形座。 导电适配器联接到壳体的第二端。 接触元件将适配器和球电耦合并保持在座椅和适配器之间的壳体中。

公开(公告)号：US20030173230A1

公开(公告)日：2003-09-18

申请号：US10098796

申请日：2002-03-13

Applicant: Applied Materials, Inc.

Inventor： Ralph Wadensweiler ,  Alain Duboust ,  Liang-Yuh Chen ,  Manoocher Birang ,  Ratson Morad ,  Paul D. Butterfield

IPC: C25F003/00 ,  C25F007/00

CPC classification number: B23H5/08 ,  C25F7/00

Abstract: A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a conductive polishing pad and an electrode having a membrane disposed therebetween. The membrane is orientated relative the conductive pad in a manner that facilitates removal of entrained gas from electrolyte flowing towards the conductive pad. The apparatus may be part of an electrochemical polishing station that may optionally be part of a system that includes chemical mechanical polishing stations.

Abstract translation: 提供了一种用于抛光衬底表面的方法和装置。 一方面，用于抛光衬底的装置包括导电抛光垫和在其间设置有膜的电极。 膜以相对于导电垫的方向定向，以便于从电解液中流出的夹带气体去除导电垫。 该设备可以是电化学抛光站的一部分，其可以可选地是包括化学机械抛光站的系统的一部分。