公开(公告)号：US20040053499A1

公开(公告)日：2004-03-18

申请号：US10608404

申请日：2003-06-26

Applicant: Applied Materials, Inc.

Inventor： Feng Q. Liu ,  Liang-Yuh Chen ,  Stan D. Tsai ,  Alain Duboust ,  Siew S. Neo ,  Yongqi Hu ,  Yan Wang ,  Paul D. Butterfield

IPC: H01L021/302 ,  H01L021/461

CPC classification number: B23H3/08 ,  B23H5/08 ,  B24B37/0056 ,  B24B37/044 ,  B24B37/046 ,  C09G1/04 ,  C25F3/02 ,  H01L21/3212 ,  H01L21/32125 ,  H01L21/32134 ,  H01L21/7684

Abstract: Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate than conductive material disposed over wide feature definitions formed in a substrate by an electrochemical mechanical polishing technique. The electrochemical mechanical polishing technique may include a polishing composition comprising an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 2 and about 10, and a solvent.

Abstract translation: 提供了抛光组合物和从衬底表面去除导电材料的方法。 在一个方面，提供了一种处理衬底以除去布置在形成于衬底中的窄特征定义之上的导电材料的方法，该导电材料以比通过电化学机械抛光技术在衬底中形成的宽特征定义上布置的导电材料更高的去除速率。 电化学机械抛光技术可以包括抛光组合物，其包含酸性电解质体系，一种或多种螯合剂，一种或多种腐蚀抑制剂，一种或多种无机或有机酸盐，一种或多种pH调节剂，以提供约 2和约10，和溶剂。

公开(公告)号：US20030234184A1

公开(公告)日：2003-12-25

申请号：US10456220

申请日：2003-06-06

Applicant: Applied Materials, Inc.

Inventor： Feng Q. Liu ,  Stan D. Tsai ,  Yongqi Hu ,  Siew S. Neo ,  Yan Wang ,  Alain Duboust ,  Liang-Yuh Chen

IPC: B23H009/00 ,  B23H007/00

CPC classification number: H01L21/32125 ,  B23H3/08 ,  B23H5/08 ,  B24B37/0056 ,  B24B37/044 ,  B24B37/046 ,  C09G1/02 ,  C09G1/04 ,  C25F3/02 ,  H01L21/32134

Abstract: Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 2 and about 10, a polishing enhancing material selected from the group of abrasive particles, one or more oxidizers, and combinations thereof, and a solvent. The composition may be used in an conductive material removal process including disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising an electrode, providing the composition between the electrode and substrate, applying a bias between the electrode and the substrate, and removing conductive material from the conductive material layer. The ECMP polishing compositions and methods described herein improve the effective removal rate of materials from the substrate surface, such as copper, with a reduction in planarization type defects and yielding a desirable surface finish.

Abstract translation: 提供了抛光组合物和从衬底表面去除导电材料的方法。 一方面，组合物包括酸性电解质体系，一种或多种螯合剂，一种或多种腐蚀抑制剂，一种或多种无机或有机酸盐，一种或多种pH调节剂，以提供约2至约10 ，选自磨料颗粒，一种或多种氧化剂及其组合的研磨增强材料和溶剂。 该组合物可用于导电材料去除工艺中，包括在包括电极的处理设备中设置其上形成有导电材料层的衬底，在电极和衬底之间提供组合物，在电极和衬底之间施加偏压，以及 从导电材料层去除导电材料。 本文所述的ECMP抛光组合物和方法提高了材料从衬底表面（例如铜）的有效去除速率，同时平坦化型缺陷减少并产生理想的表面光洁度。

公开(公告)号：US20040023610A1

公开(公告)日：2004-02-05

申请号：US10455941

申请日：2003-06-06

Applicant: Applied Materials, Inc.

Inventor： Yongqi Hu ,  Yan Wang ,  Alain Duboust ,  Feng Q. Liu ,  Antoine P. Manens ,  Siew S. Neo ,  Stan D. Tsai ,  Liang-Yuh Chen ,  Paul D. Butterfield ,  Yuan A. Tian ,  Sen-Hou Ko

IPC: B23H003/00 ,  B32B005/02

CPC classification number: B82Y30/00 ,  B23H5/08 ,  B23H5/10 ,  B24B37/046 ,  B24B37/14 ,  B24B37/16 ,  B24B37/205 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24B53/017 ,  H01L21/32125 ,  Y10T428/249924

Abstract: Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft metal and, in one embodiment, the exposed surface may be planar.

Abstract translation: 提供了用于处理基板的抛光制品的实施例。 在一个实施例中，用于处理衬底的抛光制品包括其上设置有导电层的织物层。 导电层具有适于抛光衬底的暴露表面。 织物层可以是编织的或非织造的。 导电层可以由软金属构成，并且在一个实施例中，暴露的表面可以是平面的。

公开(公告)号：US20030216045A1

公开(公告)日：2003-11-20

申请号：US10455861

申请日：2003-06-06

Applicant: Applied Materials, Inc.

Inventor： Yan Wang ,  Feng Q. Liu ,  Alain Duboust ,  Siew S. Neo ,  Liang-Yuh Chen ,  Yongqi Hu

IPC: H01L021/302 ,  H01L021/461

CPC classification number: B23H3/08 ,  B23H5/08 ,  B24B37/0056 ,  B24B37/044 ,  B24B37/046 ,  C09G1/04 ,  C25F3/02 ,  H01L21/32125 ,  H01L21/32134

Abstract: An apparatus and method for planarizing a surface of a substrate using a chamber separated into two parts by a membrane, and two separate electrolytes is provided. The embodiments of the present invention generally provide an electrochemical mechanical polishing system that reduces the number of defects found on the substrate surface after polishing. An exemplary electrochemical apparatus includes a physical barrier that prevents any trapped gas or gas generated during processing from residing in areas that can cause defects on the substrate. The process can be aided by the addition of various chemical components to the electrolyte that tend to reduce the gas generation at the cathode surface during the ECMP anodic dissolution process.

Abstract translation: 使用通过膜分离成两部分的室来平坦化基板的表面的装置和方法，以及两个单独的电解质。 本发明的实施方案通常提供一种电化学机械抛光系统，其减少抛光后在基底表面上发现的缺陷数量。 示例性电化学装置包括物理屏障，其防止在处理期间产生的任何捕获的气体或气体驻留在可能导致基板上的缺陷的区域中。 该方法可以通过在电解质中添加各种化学成分来辅助，该电解质在ECMP阳极溶解过程期间倾向于减少阴极表面的气体产生。

公开(公告)号：US20020102853A1

公开(公告)日：2002-08-01

申请号：US10026854

申请日：2001-12-20

Applicant: Applied Materials, Inc.

Inventor： Shijian Li ,  Liang-Yuh Chen ,  Alain Duboust

IPC: H01L021/302 ,  H01L021/461

CPC classification number: B24B37/24 ,  B23H5/08 ,  B24B57/02

Abstract: Methods, articles of manufacture, and apparatus are provided for depositing a layer, planarizing a layer, or combinations thereof, a material layer on a substrate. In one embodiment, an article of manufacture is provided for polishing a substrate, comprising a polishing article having a polishing surface, a plurality of passages formed through the polishing article for flow of material therethrough, and a plurality of grooves disposed in the polishing surface. The article of manufacture may be used in a processing system. The article of manufacture may be used in a method for processing a substrate, comprising positioning the substrate in an electrolyte solution containing a polishing article, optionally depositing a material on the substrate by an electrochemical deposition method, and polishing the substrate with the polishing article.

Abstract translation: 提供了方法，制品和装置，用于在衬底上沉积层，平坦化层或其组合材料层。 在一个实施例中，提供了一种用于抛光衬底的制品，其包括具有研磨表面的抛光制品，通过抛光制品形成的用于材料流动的多个通道，以及设置在抛光表面中的多个凹槽。 制品可以用在处理系统中。 制造物品可以用于处理基材的方法，包括将基底定位在含有抛光制品的电解质溶液中，任选地通过电化学沉积方法将材料沉积在基底上，并用抛光制品抛光基底。

公开(公告)号：US20030213703A1

公开(公告)日：2003-11-20

申请号：US10151538

申请日：2002-05-16

Applicant: Applied Materials, Inc.

Inventor： Yan Wang ,  Feng Q. Liu ,  Yongqi Hu ,  Alain Duboust ,  Liang-Yuh Chen ,  Paul D. Butterfield ,  Ralph M. Wadensweiler

IPC: B23H003/00

CPC classification number: B24B37/24 ,  B23H5/08 ,  B23H5/10 ,  B24B37/042

Abstract: A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a pad assembly having a conductive pad, a backing and a conductive layer adapted to be biased by a power source. In another embodiment, an apparatus for polishing a substrate includes a pad assembly disposed in a basin. The basin has two electrodes coupled to opposite poles of a power source. Each electrode extends partially through a respective aperture formed in the pad assembly. The apparatus may be part of an electro-chemical polishing station that may optionally be part of a system that includes chemical mechanical polishing stations.

Abstract translation: 提供了一种用于抛光衬底表面的方法和装置。 一方面，一种用于抛光衬底的装置包括具有导电垫，背衬和适于被电源偏置的导电层的焊盘组件。 在另一个实施例中，用于抛光衬底的装置包括设置在盆中的衬垫组件。 盆地具有耦合到电源的相对极的两个电极。 每个电极部分地延伸穿过形成在垫组件中的相应孔。 该设备可以是电化学抛光站的一部分，其可以可选地是包括化学机械抛光站的系统的一部分。

公开(公告)号：US20030178320A1

公开(公告)日：2003-09-25

申请号：US10378097

申请日：2003-02-26

Applicant: APPLIED MATERIALS, INC.

Inventor： Feng Q. Liu ,  Stan D. Tsai ,  Yongqi Hu ,  Siew S. Neo ,  Yan Wang ,  Alain Duboust ,  Liang-Yuh Chen

IPC: C25F003/00 ,  B23H007/00 ,  B23H009/00

CPC classification number: H01L21/32125 ,  B23H3/08 ,  B23H5/08 ,  B24B37/0056 ,  B24B37/044 ,  B24B37/046 ,  C09G1/02 ,  C09G1/04 ,  C25F3/02 ,  H01L21/32134

Abstract: Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 3 and about 10, a polishing enhancing material selected from the group of abrasive particles, one or more oxidizers, and combinations thereof, and a solvent. The composition may be used in an conductive material removal process including disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising an electrode, providing the composition between the electrode and substrate, applying a bias between the electrode and the substrate, and removing conductive material from the conductive material layer.

Abstract translation: 提供了抛光组合物和从衬底表面去除导电材料的方法。 一方面，组合物包括酸性电解质体系，一种或多种螯合剂，一种或多种腐蚀抑制剂，一种或多种无机或有机酸盐，一种或多种pH调节剂，以提供约3至约10的pH ，选自磨料颗粒，一种或多种氧化剂及其组合的研磨增强材料和溶剂。 该组合物可用于导电材料去除工艺中，包括在包括电极的处理设备中设置其上形成有导电材料层的衬底，在电极和衬底之间提供组合物，在电极和衬底之间施加偏压，以及 从导电材料层去除导电材料。

公开(公告)号：US20030173230A1

公开(公告)日：2003-09-18

申请号：US10098796

申请日：2002-03-13

Applicant: Applied Materials, Inc.

Inventor： Ralph Wadensweiler ,  Alain Duboust ,  Liang-Yuh Chen ,  Manoocher Birang ,  Ratson Morad ,  Paul D. Butterfield

IPC: C25F003/00 ,  C25F007/00

CPC classification number: B23H5/08 ,  C25F7/00

Abstract: A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a conductive polishing pad and an electrode having a membrane disposed therebetween. The membrane is orientated relative the conductive pad in a manner that facilitates removal of entrained gas from electrolyte flowing towards the conductive pad. The apparatus may be part of an electrochemical polishing station that may optionally be part of a system that includes chemical mechanical polishing stations.

Abstract translation: 提供了一种用于抛光衬底表面的方法和装置。 一方面，用于抛光衬底的装置包括导电抛光垫和在其间设置有膜的电极。 膜以相对于导电垫的方向定向，以便于从电解液中流出的夹带气体去除导电垫。 该设备可以是电化学抛光站的一部分，其可以可选地是包括化学机械抛光站的系统的一部分。

公开(公告)号：US20030106490A1

公开(公告)日：2003-06-12

申请号：US10215068

申请日：2002-08-07

Applicant: Applied Materials, Inc.

Inventor： Ravi Jallepally ,  Shih-Hung Li ,  Alain Duboust ,  Jun Zhao ,  Liang-Yuh Chen ,  Daniel A. Carl

IPC: C30B023/00 ,  C30B025/00 ,  C30B028/12 ,  C30B028/14

CPC classification number: C30B25/14 ,  C23C16/45521 ,  C23C16/45544 ,  C23C16/45565 ,  Y10T117/1008

Abstract: Method and apparatus for depositing layers by atomic layer deposition. A virtual shower curtain is established between the substrate support and chamber to minimize the volume in which the reactants are distributed. A showerhead may be used to allow closer placement of the substrate thereto, further reducing the reaction volume. Zero dead space volume valves with close placement to the chamber lid and fast cycle times also improve the cycle times of the process.

Abstract translation: 用于通过原子层沉积沉积层的方法和装置。 在基板支撑件和室之间建立虚拟浴帘，以使反应物分布的体积最小化。 可以使用喷头来使衬底更靠近放置，进一步减小反应体积。 零静态空间体积阀具有紧密放置在室盖和快速循环时间，也提高了工艺的循环时间。

公开(公告)号：US20040200733A1

公开(公告)日：2004-10-14

申请号：US10837955

申请日：2004-05-03

Applicant: Applied Materials, Inc.

Inventor： Ralph Wadensweiler ,  Alain Duboust ,  Liang-Yuh Chen ,  Manoocher Birang ,  Ratson Morad ,  Paul D. Butterfield

IPC: B24B001/00

CPC classification number: B23H5/08 ,  C25F7/00

Abstract: A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a conductive polishing pad and an electrode having a membrane disposed therebetween. The membrane is orientated relative the conductive pad in a manner that facilitates removal of entrained gas from electrolyte flowing towards the conductive pad. The apparatus may be part of an electro-chemical polishing station that may optionally be part of a system that includes chemical mechanical polishing stations.

Abstract translation: 提供了一种用于抛光衬底表面的方法和装置。 一方面，用于抛光衬底的装置包括导电抛光垫和在其间设置有膜的电极。 膜以相对于导电垫的方向定向，以便于从电解液中流出的夹带气体去除导电垫。 该设备可以是电化学抛光站的一部分，其可以可选地是包括化学机械抛光站的系统的一部分。