HYPERBARIC CLEAN METHOD AND APPARATUS FOR CLEANING SEMICONDUCTOR CHAMBER COMPONENTS

    公开(公告)号:US20220238355A1

    公开(公告)日:2022-07-28

    申请号:US17161557

    申请日:2021-01-28

    Abstract: Embodiments of a methods and cleaning systems for cleaning components for use in substrate processing equipment are provided herein. In some embodiments, a cleaning system includes a boiler having a heater configured to heat a fluid; a clean chamber fluidly coupled to the boiler via at least one of a gas line and a liquid line, wherein the clean chamber includes one or more fixtures in an interior volume therein for holding at least one component to be cleaned, and wherein the clean chamber includes a heater for heating the interior volume; and an expansion chamber fluidly coupled to the clean chamber via a release line for evacuating the clean chamber, wherein the release line includes a release valve to selectively open or close a flow path between the expansion chamber and the clean chamber, and wherein the expansion chamber includes a chiller and a vacuum port.

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