公开(公告)号：US11710647B2

公开(公告)日：2023-07-25

申请号：US17161557

申请日：2021-01-28

Applicant: Applied Materials, Inc.

Inventor： Richard Wells Plavidal ,  Scott Osterman ,  David W. Groechel ,  Gang Grant Peng ,  John Z. Smith

IPC: H01L21/67 ,  H01L21/02 ,  B08B3/02

CPC classification number: H01L21/67023 ,  B08B3/024 ,  H01L21/02052 ,  H01L21/67207

Abstract: Embodiments of a methods and cleaning systems for cleaning components for use in substrate processing equipment are provided herein. In some embodiments, a cleaning system includes a boiler having a heater configured to heat a fluid; a clean chamber fluidly coupled to the boiler via at least one of a gas line and a liquid line, wherein the clean chamber includes one or more fixtures in an interior volume therein for holding at least one component to be cleaned, and wherein the clean chamber includes a heater for heating the interior volume; and an expansion chamber fluidly coupled to the clean chamber via a release line for evacuating the clean chamber, wherein the release line includes a release valve to selectively open or close a flow path between the expansion chamber and the clean chamber, and wherein the expansion chamber includes a chiller and a vacuum port.