METHOD OF CLEANING SEMICONDUCTOR WAFER AND METHOD OF MANUFACTURING SEMICONDUCTOR WAFER

    公开(公告)号:US20240290665A1

    公开(公告)日:2024-08-29

    申请号:US18578884

    申请日:2022-06-29

    申请人: SUMCO Corporation

    IPC分类号: H01L21/66 H01L21/02

    CPC分类号: H01L22/20 H01L21/02052

    摘要: This method of cleaning a semiconductor wafer can reliably reduce the LPD count on the wafer surface. The method includes a first step of measuring a contact angle of a surface of a semiconductor wafer under conditions in which a volume of a droplet dripped on the surface differs, a second step of calculating a ratio of change in a measured value of the contact angle to change in the volume of the droplet based on a relationship between the volume of the droplet and the measured value of the contact angle under the conditions, a third step of determining whether pretreatment is necessary for the semiconductor wafer surface based on the ratio, a fourth step of performing the pretreatment on the semiconductor wafer surface according to the determining in the third step, and a fifth step of subsequently performing single-wafer spin cleaning on the semiconductor wafer surface.

    Method for coating photovoltaic panel, and photovoltaic power generating device using same

    公开(公告)号:US11935970B2

    公开(公告)日:2024-03-19

    申请号:US17418356

    申请日:2019-12-04

    摘要: The present invention relates to a method for coating a photovoltaic panel, and a photovoltaic power generating device using same and, more specifically, to a method for coating a photovoltaic panel, and a photovoltaic power generating device using same, wherein the method inhibits various pollutants such as dust and salt from attaching to the surface of a photovoltaic panel so as to increase power generation efficiency. The method for coating a photovoltaic panel, of the present invention, comprises: a water washing step of washing the surface of the photovoltaic panel by, spraying water thereonto; a cleaning liquid applying step of applying a cleaning liquid to the surface of the photovoltaic panel after the water washing step; a rinsing step of spraying washing water after the cleaning liquid applying step so as to remove pollutants and the cleaning liquid on the surface of the photovoltaic panel; and a coating liquid applying step of applying a coating liquid to the surface of the photovoltaic panel after the rinsing step so as to form an anti-stain coating film.

    LIQUID PROCESSING APPARATUS AND LIQUID PROCESSING METHOD

    公开(公告)号:US20240047244A1

    公开(公告)日:2024-02-08

    申请号:US18231378

    申请日:2023-08-08

    摘要: A liquid processing apparatus provided with a plurality of processors, wherein each of the processors includes a stage on which a substrate is placed, a cup surrounding the stage and the substrate placed thereon, a first processing nozzle and a second processing nozzle configured to supply a first and second processing liquid to the substrate, respectively, a first standby portion where the first processing nozzle stands by, a second standby portion where the second processing nozzle stands by, a first mover configured to move the first processing nozzle between the first standby portion and a first processing position, a second mover configured to move the second processing nozzle between the second standby portion and a second processing position, and a guide shared by the first mover and the second mover such that each of the first mover and the second mover moves in the left-right direction.

    UNIT FOR SUPPLYING CHEMICAL AND APPARATUS FOR TREATING SUBSTRATE WITH THE UNIT

    公开(公告)号:US20240047236A1

    公开(公告)日:2024-02-08

    申请号:US18138037

    申请日:2023-04-22

    申请人: SEMES CO., LTD.

    IPC分类号: H01L21/67 H01L21/02

    摘要: The present disclosure provides an apparatus for treating a substrate, comprising: a chemical discharge pipe; a cover configured to surround the chemical discharge pipe; a buffer disposed in a space between the chemical discharge pipe and the cover; a chemical supplier configured to supply a chemical to the chemical discharge pipe; a cleaning liquid supplier configured to supply a cleaning liquid via the cover; and a dry gas supplier configured to supply a dry gas via the cover, wherein the supplied cleaning liquid is sprayed by passing through the buffer via a space between the outside of the chemical discharge pipe and the inside of the cover to clean a tip of the chemical discharge pipe, and the supplied dry gas is sprayed by passing through the buffer via the space between the outside of the chemical discharge pipe and the inside of the cover to dry the tip of the chemical discharge pipe.