公开(公告)号：US20250015733A1

公开(公告)日：2025-01-09

申请号：US18218794

申请日：2023-07-06

Applicant: Applied Materials, Inc.

Inventor： Mukund SUNDARARAJAN ,  Sarath BABU ,  Cheng-Hsiung Matthew TSAI ,  Ananthkrishna JUPUDI ,  Ross MARSHALL

IPC: H02N13/00 ,  B23Q3/15 ,  B23Q11/12

Abstract: Embodiments of bipolar electrostatic chucks are provided herein. In some embodiments, a bipolar electrostatic chuck, includes: the electrostatic chuck; and a plurality of electrodes disposed in the electrostatic chuck, wherein the plurality of electrodes include a positive electrode arranged in a first pattern comprising a plurality of first arcuate bands coupled together via first connection fingers that extend radially therebetween and a negative electrode arranged in a second pattern comprising a plurality of second arcuate bands coupled together via second connection fingers that extend radially therebetween, wherein the plurality of first arcuate bands are arranged in an alternating pattern with the plurality of second arcuate bands, wherein there is a gap between the first pattern and the second pattern.

公开(公告)号：US20240266200A1

公开(公告)日：2024-08-08

申请号：US18107157

申请日：2023-02-08

Applicant: Applied Materials, Inc.

Inventor： Sarath BABU ,  Mukund SUNDARARAJAN ,  Cheng-Hsiung TSAI ,  Ananthkrishna JUPUDI ,  Ross MARSHALL

IPC: H01L21/683 ,  H01L21/67

CPC classification number: H01L21/6833 ,  H01L21/67103

Abstract: An electrostatic chuck assembly including a body including a body recess and a heat transfer plate disposed in the body recess, wherein the heat transfer plate includes an upper surface, a lower surface, a first opening, and a second opening. The electrostatic chuck assembly further includes an RF transmission tube configured to transfer RF power to the lower surface of the heat transfer plate. The electrostatic chuck assembly further includes a puck bonded to the upper surface of the heat transfer plate. The electrostatic chuck assembly further includes a first chucking electrode disposed in the first opening and a second chucking electrode is disposed in the second opening, wherein the first and second chucking electrodes are configured to transfer a chucking voltage to the puck.

公开(公告)号：US20150146339A1

公开(公告)日：2015-05-28

申请号：US14550106

申请日：2014-11-21

Applicant: Applied Materials, Inc.

Inventor： Govinda RAJ ,  Cheng-Hsiung TSAI ,  Robert T. HIRAHARA ,  Kadthala R. NARENDRNATH ,  Manjunatha KOPPA ,  Ross MARSHALL

IPC: H01L21/683

CPC classification number: H01L21/6875 ,  H01L21/6831 ,  Y10T428/24298 ,  Y10T428/24314

Abstract: Embodiments are directed to an electrostatic chuck surface having minimum contact area features. More particularly, embodiments of the present invention provide an electrostatic chuck assembly having a pattern of raised, elongated surface features for providing reduced particle generation and reduced wear of substrates and chucking devices.

Abstract translation: 实施例涉及具有最小接触面积特征的静电卡盘表面。 更具体地，本发明的实施例提供一种具有凸起的细长表面特征图案的静电卡盘组件，用于提供减少的颗粒产生和减少基板和夹紧装置的磨损。