公开(公告)号：US20190318957A1

公开(公告)日：2019-10-17

申请号：US16283560

申请日：2019-02-22

Applicant: Applied Materials, Inc.

Inventor： Ludovic GODET ,  Wayne MCMILLAN ,  Rutger MEYER TIMMERMAN THIJSSEN ,  Naamah ARGAMAN ,  Tapashree ROY ,  Sage DOSHAY

IPC: H01L21/768 ,  H01L21/3213 ,  H01L25/16 ,  H01L25/04 ,  H01L21/311

Abstract: Systems and methods herein are related to the formation of optical devices including stacked optical element layers using silicon wafers, glass, or devices as substrates. The optical elements discussed herein can be fabricated on temporary or permanent substrates. In some examples, the optical devices are fabricated to include transparent substrates or devices including charge-coupled devices (CCD), or complementary metal-oxide semiconductor (CMOS) image sensors, light-emitting diodes (LED), a micro-LED (uLED) display, organic light-emitting diode (OLED) or vertical-cavity surface-emitting laser (VCSELs). The optical elements can have interlayers formed in between optical element layers, where the interlayers can range in thickness from 1 nm to 3 mm.