公开(公告)号：US20240379896A1

公开(公告)日：2024-11-14

申请号：US18656825

申请日：2024-05-07

Applicant: Applied Materials, Inc.

Inventor： Shinobu Abe ,  Scott Yongkee Chae ,  Shinichi Kurita ,  Duoyan Shen

IPC: H01L31/20 ,  H01L31/0224 ,  H01L31/043

Abstract: A substrate processing system includes two or more process tools including multiple process chambers to perform a corresponding substrate processing procedure and a substrate transport to transport substrates between the two or more process tools. The system further includes a control system to cause one or more first layers to be deposited on a substrate in one or more first process chambers to form a first cell of a tandem cell structure. The control system is further to cause the substrate to be transported from the one or more first process chambers to one or more second process chambers. A combination process tool includes the one or more second process chambers. The control system is further to cause one or more second layers to be deposited on the substrate in the one or more second process chambers to form a second cell of the tandem cell structure.