公开(公告)号：US20250149373A1

公开(公告)日：2025-05-08

申请号：US18545643

申请日：2023-12-19

Applicant: Applied Materials, Inc.

Inventor： Nitin Deepak ,  Jennifer Sun ,  Mayur Govind Kulkarni ,  Miguel S. Fung ,  Darius "D" Alexander-Jones ,  Chih Peng ,  Deenesh Padhi ,  Kwangduk Douglas Lee ,  Ganesh Balasubramanian ,  Juan Carlos Rocha-Alvarez ,  Simmon Kuo ,  Nagarajan Rajagopalan ,  Shankho Sen

IPC: H01L21/687

Abstract: Semiconductor components and systems having substrate contacting surfaces with a reduced hardness are provided. Systems and components include a ceramic, metallic, or non-metallic component for contacting a substrate. Systems and components include a layer of coating material on at least a portion of a substrate contacting surface of the component. Systems and components include where the component for contacting a substrate includes a component Vickers hardness value, and the layer of coating material exhibits a coating layer Vickers hardness value. Systems and components include where the coating layer Vickers hardness value is greater than or about 10% less than the component Vickers hardness value.