METHOD AND APPARATUS FOR SEMICONDUCTOR PROCESSING CHAMBER ISOLATION FOR REDUCED PARTICLES AND IMPROVED UNIFORMITY

    公开(公告)号:US20180211820A1

    公开(公告)日:2018-07-26

    申请号:US15866506

    申请日:2018-01-10

    Abstract: Implementations of the present disclosure generally relate to apparatus and methods for uniform deposition of thin films on substrates. In one implementation, a plasma-processing chamber comprises a chamber body including chamber walls, a chamber floor, and a lid support. The plasma-processing chamber further comprises a substrate support assembly at least partially disposed within the chamber body and configured to support a substrate. The plasma-processing chamber further comprises a lid assembly disposed over the support assembly and positioned on the lid support wherein the lid assembly and the chamber body define a first processing volume. The plasma-processing chamber further comprises a bottom isolation assembly that circumscribes at least a portion of the substrate support assembly and is vertically movable from a loading position to a processing position. A seal is formed between the bottom isolation assembly and the lid assembly when the bottom isolation assembly is in the processing position.

    ECO-EFFICIENCY CHARACTERIZATION TOOL
    2.
    发明申请

    公开(公告)号:US20170308071A1

    公开(公告)日:2017-10-26

    申请号:US15134234

    申请日:2016-04-20

    CPC classification number: G05B19/41885 G05B2219/42155 Y02P90/26

    Abstract: A method for wafer point by point analysis includes receiving a selection of manufacturing equipment, utility use data, and utilization data. A water eco-efficiency characterization is calculated based on the utilization data and the utility use data. An emissions eco-efficiency characterization is calculated based on the utilization data and the utility use data. An electrical energy eco-efficiency characterization is calculated based on the utilization data and the utility use data. A combined eco-efficiency characterization is calculated based on the utilization data and water eco-efficiency characterization, emissions eco-efficiency characterization, and electrical energy eco-efficiency characterizations. The combined eco-efficiency characterization is provided for display by a graphical user interface.

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