公开(公告)号：US20230019718A1

公开(公告)日：2023-01-19

申请号：US17953205

申请日：2022-09-26

Applicant: Applied Materials, Inc.

Inventor： Steven Joseph LAROSA ,  Stephen PROUTY

IPC: H01J37/32 ,  H01L21/683

Abstract: The systems and methods discussed herein are associated with substrate support pedestals used in processing chambers to manufacture semiconductors, electronics, optics, and other devices. The substrate support pedestals include an electrostatic chuck body bonded to a cooling base via a bond layer. A gas flow passage is formed between a top surface of the electrostatic chuck body and a bottom surface of the cooling base, and a porous plug is positioned in the gas flow passage. The gas flow passage passes through a hole in the bond layer and the porous plug and has a swept volume physically shielded from an inside edge of the hole in the bond layer, protecting the bond layer from erosion.

公开(公告)号：US20190088531A1

公开(公告)日：2019-03-21

申请号：US16103531

申请日：2018-08-14

Applicant: Applied Materials, Inc.

Inventor： Yogananda SARODE VISHWANATH ,  Steven E. BABAYAN ,  Stephen PROUTY ,  Andreas SCHMID

IPC: H01L21/687 ,  C23C16/458 ,  H01J37/32

Abstract: Aspects of the present disclosure generally relate to apparatuses and methods for edge ring replacement in processing chambers. In one aspect, a carrier for supporting an edge ring is disclosed. In other aspects, robot blades for supporting a carrier are disclosed. In another aspect, a support structure for supporting a carrier in a degassing chamber is disclosed. In another aspect, a method of transferring an edge ring on a carrier is disclosed.

公开(公告)号：US20170133244A1

公开(公告)日：2017-05-11

申请号：US15335059

申请日：2016-10-26

Applicant: Applied Materials, Inc.

Inventor： Vladimir KNYAZIK ,  Shahid RAUF ,  Stephen PROUTY ,  Roland SMITH ,  Denis M. KOOSAU

IPC: H01L21/67 ,  F28F13/06 ,  H01L21/683 ,  F28F3/12

CPC classification number: H01L21/67103 ,  F28D1/0473 ,  F28D7/04 ,  F28F3/12 ,  H01L21/67109

Abstract: Implementations described herein provide a cooling base and a substrate support assembly having the same. In one example, a cooling base is provided that includes a body coupled to a cap. A plurality cooling channels are disposed in the body and bounded on at least one side by the cap. The plurality cooling channels have a polar array of spirals.