公开(公告)号：US20170345623A1

公开(公告)日：2017-11-30

申请号：US15677929

申请日：2017-08-15

Applicant: Applied Materials, Inc.

Inventor： Andrew NGUYEN ,  Bradley HOWARD ,  Shahid RAUF ,  Ajit BALAKRISHNA ,  Tom K. CHOI ,  Kenneth S. COLLINS ,  Anand KUMAR ,  Michael D. WILLWERTH ,  Yogananda SARODE VISHWANATH

IPC: H01J37/32 ,  B29C65/00 ,  B32B1/02 ,  B01D45/08

Abstract: Embodiments of the present disclosure generally provide various apparatus and methods for reducing particles in a semiconductor processing chamber. One embodiment of present disclosure provides a vacuum screen assembly disposed over a vacuum port to prevent particles generated by the vacuum pump from entering substrate processing regions. Another embodiment of the present disclosure provides a perforated chamber liner around a processing region of the substrate. Another embodiment of the present disclosure provides a gas distributing chamber liner for distributing a cleaning gas around the substrate support under the substrate supporting surface.