公开(公告)号：US20250035215A1

公开(公告)日：2025-01-30

申请号：US18225673

申请日：2023-07-24

Applicant: Applied Materials, Inc.

Inventor： Chetan Ramachandra NAIK ,  Anand KUMAR

IPC: F16K1/36 ,  F16K1/42 ,  F16K27/02

Abstract: Embodiments of symmetric flow valves for use in substrate processing chambers are provided herein. In some embodiments, a symmetric flow valve includes: a valve body having sidewalls, a bottom plate, and a top plate that together define an interior volume, wherein the top plate includes a plurality of axisymmetrically disposed openings arranged in a non-linear manner, and wherein the bottom plate includes a port opening; an actuator disposed above the top plate and coupled to a central region of the top plate radially inward of the plurality of axisymmetrically disposed openings; and a poppet disposed in the interior volume and coupled to the actuator to move the poppet vertically within the interior volume, wherein the poppet is configured to selectively seal the plurality of axisymmetrically disposed openings or the port opening.

公开(公告)号：US20210233799A1

公开(公告)日：2021-07-29

申请号：US17227066

申请日：2021-04-09

Applicant: Applied Materials, Inc.

Inventor： Yogananda SARODE VISHWANATH ,  Anand KUMAR

IPC: H01L21/687 ,  H01L21/683 ,  H01J37/32 ,  H01L21/67

Abstract: Apparatuses for substrate transfer are provided. A lift pin assembly can include a lift pin, a purge cylinder, and a lift pin guide. The lift pin guide is disposed adjacent the purge cylinder. The lift pin guide and the purge cylinder have a passage formed therethrough in which the lift pin is disposed. The purge cylinder includes one or more nozzles that direct the flow of gas radially inward into a portion of the passage disposed in the purge cylinder. The one or more nozzles are disposed radially outward from the lift pin. The purge cylinder reduces particle deposition on the substrate by preventing contact between the lift pin and the support assembly as the lift pin is in motion.

公开(公告)号：US20140272211A1

公开(公告)日：2014-09-18

申请号：US14200077

申请日：2014-03-07

Applicant: Applied Materials, Inc.

Inventor： Andrew NGUYEN ,  Bradley HOWARD ,  Shahid RAUF ,  Ajit BALAKRISHNA ,  Tom K. CHO ,  Kenneth S. COLLINS ,  Anand KUMAR ,  Michael D. WILLWERTH ,  Yogananda S. VISHWANATH

IPC: H01J37/32 ,  B01D45/08

CPC classification number: H01J37/32495 ,  B01D45/08 ,  B29C66/71 ,  B32B1/02 ,  H01J37/32449 ,  H01J37/32477 ,  H01J37/32871 ,  Y10T428/13

Abstract: Embodiments of the present disclosure generally provide various apparatus and methods for reducing particles in a semiconductor processing chamber. One embodiment of present disclosure provides a vacuum screen assembly disposed over a vacuum port to prevent particles generated by the vacuum pump from entering substrate processing regions. Another embodiment of the present disclosure provides a perforated chamber liner around a processing region of the substrate. Another embodiment of the present disclosure provides a gas distributing chamber liner for distributing a cleaning gas around the substrate support under the substrate supporting surface.

Abstract translation: 本公开的实施例通常提供用于减少半导体处理室中的颗粒的各种装置和方法。 本公开的一个实施例提供一种设置在真空端口上的真空屏幕组件，以防止由真空泵产生的颗粒进入衬底处理区域。 本公开的另一个实施例提供围绕衬底的处理区域的穿孔室衬里。 本公开的另一个实施例提供一种气体分配室衬套，用于在衬底支撑表面下方的衬底支撑件周围分配清洁气体。

公开(公告)号：US20170345623A1

公开(公告)日：2017-11-30

申请号：US15677929

申请日：2017-08-15

Applicant: Applied Materials, Inc.

Inventor： Andrew NGUYEN ,  Bradley HOWARD ,  Shahid RAUF ,  Ajit BALAKRISHNA ,  Tom K. CHOI ,  Kenneth S. COLLINS ,  Anand KUMAR ,  Michael D. WILLWERTH ,  Yogananda SARODE VISHWANATH

IPC: H01J37/32 ,  B29C65/00 ,  B32B1/02 ,  B01D45/08

Abstract: Embodiments of the present disclosure generally provide various apparatus and methods for reducing particles in a semiconductor processing chamber. One embodiment of present disclosure provides a vacuum screen assembly disposed over a vacuum port to prevent particles generated by the vacuum pump from entering substrate processing regions. Another embodiment of the present disclosure provides a perforated chamber liner around a processing region of the substrate. Another embodiment of the present disclosure provides a gas distributing chamber liner for distributing a cleaning gas around the substrate support under the substrate supporting surface.

公开(公告)号：US20240344199A1

公开(公告)日：2024-10-17

申请号：US18456836

申请日：2023-08-28

Applicant: Applied Materials, Inc.

Inventor： Yogananda Sarode Vishwanath ,  Anand KUMAR ,  George KIM

IPC: C23C16/455 ,  C23C16/52 ,  H01J37/32 ,  H01L21/02

CPC classification number: C23C16/45563 ,  C23C16/52 ,  H01J37/32449 ,  H01J37/32798 ,  H01L21/02274 ,  H01J2237/3321 ,  H01J2237/334

Abstract: Semiconductor processing systems and system components are described. The system components include a chamber lid of a semiconductor processing chamber that includes a dielectric material having a substantially disk shape and integrating a lid portion and a gas delivery nozzle portion into a single structure. The chamber lid includes a plurality of gas flow paths that each traverse a region of the chamber lid from an input location at a first surface of the chamber lid to a respective output location on a different surface of the chamber lid and through which etch gases are distributed to particular portions of a processing region of the processing chamber.

公开(公告)号：US20240266206A1

公开(公告)日：2024-08-08

申请号：US18640411

申请日：2024-04-19

Applicant: Applied Materials, Inc.

Inventor： Yogananda SARODE VISHWANATH ,  Anand KUMAR

IPC: H01L21/687 ,  C23C16/44 ,  H01J37/32 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L21/68742 ,  C23C16/4401 ,  H01J37/32715 ,  H01L21/67017 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/6833 ,  H01L21/68757 ,  H01L21/68785 ,  H01J37/32449 ,  H01L21/67069

Abstract: Apparatuses for substrate transfer are provided. A lift pin assembly can include a lift pin, a purge cylinder, and a lift pin guide. The lift pin guide is disposed adjacent the purge cylinder. The lift pin guide and the purge cylinder have a passage formed therethrough in which the lift pin is disposed. The purge cylinder includes one or more nozzles that direct the flow of gas radially inward into a portion of the passage disposed in the purge cylinder. The one or more nozzles are disposed radially outward from the lift pin. The purge cylinder reduces particle deposition on the substrate by preventing contact between the lift pin and the support assembly as the lift pin is in motion.

公开(公告)号：US20190027394A1

公开(公告)日：2019-01-24

申请号：US16010250

申请日：2018-06-15

Applicant: Applied Materials, Inc.

Inventor： Yogananda SARODE VISHWANATH ,  Anand KUMAR

IPC: H01L21/687 ,  H01L21/683 ,  H01J37/32

Abstract: Apparatuses for substrate transfer are provided. A lift pin assembly can include a lift pin, a purge cylinder, and a lift pin guide. The lift pin guide is disposed adjacent the purge cylinder. The lift pin guide and the purge cylinder have a passage formed therethough in which the lift pin is disposed. The purge cylinder includes one or more nozzles that direct the flow of gas radially inward into a portion of the passage disposed in the purge cylinder. The one or more nozzles are disposed radially outward from the lift pin. The purge cylinder reduces particle deposition on the substrate by preventing contact between the lift pin and the support assembly as the lift pin is in motion.