公开(公告)号：US20250157855A1

公开(公告)日：2025-05-15

申请号：US18940315

申请日：2024-11-07

Applicant: Applied Materials, Inc.

Inventor： Bhaskar Jyoti Bhuyan ,  Aaron Dangerfield ,  Jesus Candelario Mendoza-Gutierrez ,  Mark Saly ,  Chandan Kr Bank ,  Andrea Leoncini ,  Wei Chun Lim ,  Sze Chieh Tan ,  Lisa J. Enman

IPC: H01L21/768 ,  C23C16/02 ,  H01L21/02

Abstract: Methods for selectively depositing a material on a dielectric surface relative to a metallic surface are disclosed. The metallic surface is protected with a self-assembled monolayer comprising an N-heterocyclic carbene prior to deposition of a liner or barrier layer on adjacent dielectric surfaces.