PROTECTIVE CAPPING LAYER FOR AREA SELECTIVE DEPOSITION

    公开(公告)号:US20240332072A1

    公开(公告)日:2024-10-03

    申请号:US18613998

    申请日:2024-03-22

    Inventor: Andrea Leoncini

    Abstract: Described are methods of forming a protective capping layer on a metal layer of a semiconductor substrate. A metal layer is deposited using a metal precursor and a reactant pulsed to form the metal layer having a reactive surface. The number of cycles can be in a range of from 1 to 10 cycles or from 2 to 5 cycles or from 2 to 100 cycles. The metal layer is then exposed to a long chain precursor (e.g., primary amines, alcohols, thiols, phosphines, selenols) and a metal precursor to form a protective capping layer on the metal layer. The number of cycles can be in a range of from 1 to 10 cycles or from 2 to 5 cycles, depending upon the desired thickness of the protective capping layer.

    MODULAR HEATING JACKET WITH REMOLDABLE INSULATOR

    公开(公告)号:US20250003076A1

    公开(公告)日:2025-01-02

    申请号:US18214918

    申请日:2023-06-27

    Abstract: Embodiments of the disclosure relate to heating jackets comprising a reformable insulator. The insulator may be shaped to conform to the shape of a vapor deposition precursor delivery system, or a portion thereof, and subsequently reformed to a different vapor deposition precursor delivery system, or a portion thereof. Some embodiments of the disclosure combine multiple heating modules to form a heating jacket. The heating modules contain a flexible heating element and an insulating, protective cover.

Patent Agency Ranking