公开(公告)号：US20200098549A1

公开(公告)日：2020-03-26

申请号：US16143280

申请日：2018-09-26

Applicant: Applied Materials, Inc.

Inventor： Beom Soo PARK ,  Robin L. TINER ,  Jianheng LI ,  Sang Jeong OH ,  Lai ZHAO ,  Gaku FURUTA ,  Soo Young CHOI ,  Jeevan Prakash SEQUEIRA ,  Wei-Ting CHEN ,  Hsiao-Ling YANG ,  Cheng-Hang HSU ,  Won Ho SUNG ,  Hyun Young HONG

IPC: H01J37/32 ,  C23C16/505

Abstract: A plasma processing chamber includes a chamber body and a lid assembly coupled to the chamber body to define a processing volume. The lid assembly includes a backing plate coupled to the chamber body, a diffuser with a plurality of openings formed therethrough, and a heat conductive spacer disposed between and coupled to the backing plate and the diffuser to transfer heat from the diffuser to the backing plate. The plasma processing chamber further includes a substrate support disposed within the processing volume.