公开(公告)号：US20030019741A1

公开(公告)日：2003-01-30

申请号：US09912578

申请日：2001-07-24

Applicant: Applied Materials, Inc.

Inventor： Arnold V. Kholodenko ,  Yan Rozenzon

IPC: C25D017/00 ,  C25D017/04 ,  B05C003/00

CPC classification number: C25D7/12 ,  C25D17/004 ,  C25D17/06

Abstract: Apparatus for securing a substrate in an electrochemical deposition system are provided. In one aspect, an apparatus is provided for securing a substrate in an electrochemical deposition system having a contact ring for contacting a plating surface of the substrate, a thrust plate having an annular shoulder at least partially formed therein, the thrust plate adapted to move axially relative to the contact surface, and a flexible seal disposed on the thrust plate comprising a base portion for attaching to the annular shoulder of the thrust plate and a body portion extending outwardly from the base portion and defining a sealing surface for engaging a back surface of the substrate. The apparatus may be disposed in an electrochemical deposition system.

Abstract translation: 提供了用于将基板固定在电化学沉积系统中的装置。 一方面，提供了一种用于将基板固定在电化学沉积系统中的装置，该电化学沉积系统具有用于接触基板的电镀表面的接触环，具有至少部分地形成在其中的环形肩部的推力板，该推力板适于轴向移动 以及设置在推力板上的柔性密封件，包括用于附接到推力板的环形肩部的基部和从基部向外延伸的主体部分，并且限定用于接合 底物。 该设备可以设置在电化学沉积系统中。