MULTI-PERSPECTIVE WAFER ANALYSIS
    1.
    发明申请

    公开(公告)号:US20200232934A1

    公开(公告)日:2020-07-23

    申请号:US16746739

    申请日:2020-01-17

    Abstract: Disclosed herein is a method for detecting defects on a sample. The method includes obtaining scan data of a region of a sample in a multiplicity of perspectives, and performing an integrated analysis of the obtained scan data. The integrated analysis includes computing, based on the obtained scan data, and/or estimating cross-perspective covariances, and determining presence of defects in the region, taking into account the cross-perspective covariances.

    COMPUTERIZED SYSTEM AND METHOD FOR OBTAINING INFORMATION ABOUT A REGION OF AN OBJECT

    公开(公告)号:US20200234418A1

    公开(公告)日:2020-07-23

    申请号:US16250980

    申请日:2019-01-17

    Abstract: A method, system and computer readable medium for providing information about a region of a sample. The method includes (i) obtaining, by an imager, multiple images of the region; wherein the multiple images differ from each other by at least one parameter (ii) receiving or generating multiple reference images; (iii) generating multiple difference images that represent differences between the multiple images and the multiple reference images; (iv) calculating a set of region pixel attributes, (v) calculating a set of noise attributes, based on multiple sets of region pixels attributes of the multiple region pixels; and (vi) determining for each region pixel, whether the region pixel represents a defect based on a relationship between the set of noise attributes and the set of region pixel attributes of the pixel.

Patent Agency Ranking