公开(公告)号：US20210256687A1

公开(公告)日：2021-08-19

申请号：US16794172

申请日：2020-02-18

Applicant: Applied Materials Israel Ltd.

Inventor： Doron GIRMONSKY ,  Rafael BEN AMI ,  Boaz COHEN ,  Dror SHEMESH

IPC: G06T7/00 ,  G06F17/18

Abstract: There is provided a method and a system configured to obtain an image of a one or more first areas of a semiconductor specimen acquired by an examination tool, determine data Datt informative of defectivity in the one or more first areas, determine one or more second areas of the semiconductor specimen for which presence of a defect is suspected based at least on an evolution of Datt, or of data correlated to Datt, in the one or more first areas, and select the one or more second areas for inspection by the examination tool.

公开(公告)号：US20230114624A1

公开(公告)日：2023-04-13

申请号：US17496616

申请日：2021-10-07

Applicant: Applied Materials Israel Ltd.

Inventor： Dror SHEMESH ,  Miriam BROOK

IPC: G06T7/00 ,  G01N21/95

Abstract: There is provided a system and method of runtime defect examination of a semiconductor specimen, comprising obtaining a first image representative of at least part of the semiconductor specimen, the first image acquired by an examination tool configured with a first focus plane; estimating whether the first image is in focus using a machine learning (ML) model, wherein the ML model is previously trained for classifying images into focused images and defocused images; upon an estimation that the first image is out of focus, performing focus calibration on the examination tool to select a second focus plane associated with an optimal focus score; and obtaining a second image acquired by the examination tool configured with the second focus plane, and estimating whether the second image is in focus using the ML model. The second image, upon being estimated as being in focus, is usable for defect examination on the specimen.