VACUUM CHUCK FOR HIGH WARPAGE WAFERS

    公开(公告)号:US20250153292A1

    公开(公告)日:2025-05-15

    申请号:US18510505

    申请日:2023-11-15

    Inventor: Hagay Cafri

    Abstract: A vacuum chuck for supporting a sample, the vacuum chuck comprising: a support plate having an upper planar support surface sized and shaped to retain a sample disposed thereon; one or more vacuum lines formed within the support plate; a plurality of cavities formed within the support plate, wherein each cavity is fluidly coupled to a vacuum line in the one or more vacuum lines and includes an aperture at an upper surface of the planar support surface; and a plurality of vacuum pad plungers corresponding in number to the plurality of cavities, wherein each vacuum pad plunger is disposed in a unique one of the cavities and comprises a plunger body having a vacuum channel extending through its length and a biasing mechanism, wherein the plunger body is moveable between an up position in which a portion of the plunger body extends through the aperture of its respective cavity protruding above the upper planar support surface and a down position in which the plunger body is retracted into the cavity, and wherein the biasing mechanism biases the plunger body in the up position.

    ROBOT BLADE AND WAFER BREAKAGE PREVENTION SYSTEM

    公开(公告)号:US20250065509A1

    公开(公告)日:2025-02-27

    申请号:US18236322

    申请日:2023-08-21

    Abstract: An apparatus that includes an end effector for handling and transporting wafers, the end effector including: a base portion having a first end adapted to be attached to a robot; a wafer support platform having a surface to support a wafer, a slidable joint coupling the base portion to the wafer support platform; and a sensor configured to detect when the wafer support platform slides relative to the base portion beyond a predetermined distance.

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