公开(公告)号：US12272042B2

公开(公告)日：2025-04-08

申请号：US17565273

申请日：2021-12-29

Applicant: Applied Materials Israel Ltd.

Inventor： Elad Cohen ,  Victor Egorov ,  Ilan Ben-Harush ,  Rafael Bistritzer

IPC: G06T7/00 ,  G06T7/10

Abstract: There is provided a system of examination of a semiconductor specimen, comprising a processor and memory circuitry configured to obtain, for each given candidate defect of a plurality of candidate defects in an image of the specimen, a given area of the given candidate defect in the image, obtain a reference image, perform a segmentation of at least part of the reference image, to determine, for each given candidate defect, first reference areas in the reference image matching a given reference area corresponding to the given area, select among the first reference areas, a plurality of second reference areas, obtain a plurality of corresponding second areas in the image, and use data informative of a pixel intensity of the second areas and data informative of a pixel intensity of the given area to determine whether the given candidate defect corresponds to a defect.

公开(公告)号：US12299868B2

公开(公告)日：2025-05-13

申请号：US17580541

申请日：2022-01-20

Applicant: Applied Materials Israel Ltd.

Inventor： Einat Frishman ,  Ilan Ben-Harush ,  Rafael Bistritzer

IPC: G06T7/00 ,  G01B11/24 ,  G01N21/95 ,  G06T7/64

Abstract: There is provided a system and a method comprising obtaining data Dcontour informative of a contour of an element of a semiconductor specimen acquired by an examination tool, using the data Dcontour to generate a signal informative of a curvature of the contour of the element, determining at least one of data Dperiodicity informative of a periodicity of the signal, or data Ddiscontinuities informative of a number of discontinuities in the signal, wherein each discontinuity is informative of a transition between a convex portion of the contour and a concave portion of the contour, and using at least one of the data Dperiodicity or the data Ddiscontinuities to determine data informative of correct manufacturing of the element.

公开(公告)号：US11686571B2

公开(公告)日：2023-06-27

申请号：US17465753

申请日：2021-09-02

Applicant: Applied Materials Israel Ltd.

Inventor： Roman Kris ,  Ilan Ben-Harush ,  Rafael Bistritzer ,  Vadim Vereschagin ,  Elad Sommer ,  Grigory Klebanov ,  Arundeepth Thamarassery ,  Jannelle Anna Geva ,  Gal Daniel Gutterman ,  Einat Frishman ,  Sahar Levin

IPC: G01B11/24 ,  G01B9/02 ,  G06T7/00

CPC classification number: G01B9/02043 ,  G01B9/02084 ,  G01B11/24 ,  G06T7/001 ,  G06T2207/30148

Abstract: There is provided a system and method of a method of detecting a local shape deviation of a structural element in a semiconductor specimen, comprising: obtaining an image comprising an image representation of the structural element; extracting, from the image, an actual contour of the image representation; estimating a reference contour of the image representation indicative of a standard shape of the structural element, wherein the reference contour is estimated based on a Fourier descriptor representative of the reference contour, the Fourier descriptor being estimated using an optimization method based on a loss function specifically selected to be insensitive to local shape deviation of the actual contour; and performing one or more measurements representative of one or more differences between the actual contour and the reference contour, the measurements indicative of whether a local shape deviation is present in the structural element.

公开(公告)号：US11443420B2

公开(公告)日：2022-09-13

申请号：US17135939

申请日：2020-12-28

Applicant: Applied Materials Israel Ltd.

Inventor： Roman Kris ,  Grigory Klebanov ,  Einat Frishman ,  Tal Orenstein ,  Meir Vengrover ,  Noa Marom ,  Ilan Ben-Harush ,  Rafael Bistritzer ,  Sharon Duvdevani-Bar

IPC: G06T7/00 ,  G03F7/20 ,  G01N21/95

Abstract: There is provided a system and method of generating a metrology recipe usable for examining a semiconductor specimen, comprising: obtaining a first image set comprising a plurality of first images captured by an examination tool, obtaining a second image set comprising a plurality of second images, wherein each second image is simulated based on at least one first image, wherein each second image is associated with ground truth data; performing a first test on the first image set and a second test on the second image set in accordance with a metrology recipe configured with a first parameter set, and determining, in response to a predetermined criterion not being met, to select a second parameter set, configure the metrology recipe with the second parameter set, and repeat the first test and the second test in accordance with the metrology recipe configured with the second parameter set.