Server Rack for Electronic Components
    2.
    发明公开

    公开(公告)号:US20240215206A1

    公开(公告)日:2024-06-27

    申请号:US18395181

    申请日:2023-12-22

    IPC分类号: H05K7/20

    摘要: A server rack system for receiving and coupling one or more electronic components to a vehicle system includes a housing. The housing is configured to receive the one or more electronic components. The server rack system includes a heat-conducting structural component. A cooling system includes a heat source and a heat sink. An active cooling system includes a cold plate coupled to a cooling system defining a heat sink. A passively cooled electronic component defines a heat source. A hybrid cooling system is configured to provide a heat transfer from the passively cooled electronic component to the cold plate by heat conduction via the structural component.