ELECTRONIC DEVICE ASSEMBLY APPARATUS
    5.
    发明公开

    公开(公告)号:US20240147616A1

    公开(公告)日:2024-05-02

    申请号:US18496935

    申请日:2023-10-30

    IPC分类号: H05K1/03 H05K13/00 H05K13/04

    摘要: In an electronic device assembly apparatus that inserts a leading end of flat and flexible cables 162 and 166 into connectors 164 and 168 on a circuit board 160, a gripping device 200 includes a first gripping mechanism 210 and a second gripping mechanism 212, a rotational mechanism 260, and a width direction open/close mechanism 240, and the width direction open/close mechanism 240 includes a first cylinder 244 and a second cylinder 270 that causes the first and the second gripping mechanism to perform a width adjustment movement in the same direction as the first cylinder, and the second cylinder has a lock function for fixing the second cylinder at a predetermined position.

    Reconfigurable circuit devices
    7.
    发明授权

    公开(公告)号:US11924966B1

    公开(公告)日:2024-03-05

    申请号:US17402425

    申请日:2021-08-13

    申请人: Innovium, Inc.

    IPC分类号: H05K1/02 G06F30/394 H01L23/66

    摘要: Loss reduction methods are described. A first transmission loss associated with signal transmission through a trace in a first circuit board design is determined. The trace is routed from an integrated circuit disposed on a circuit board to a circuit element disposed on the circuit board. It is determined that the first transmission loss is greater than a threshold transmission loss. The first circuit board design is altered to obtain a second circuit board design. In the second circuit board design, the trace is routed from the integrated circuit to a connector disposed on the circuit board, and the connector is electrically coupled to the circuit element by a cable. A second transmission loss associated with signal transmission between the integrated circuit and the circuit element in the second circuit board design is less than the threshold transmission loss.

    Surface mounted assembly and related endoscope

    公开(公告)号:US11832799B2

    公开(公告)日:2023-12-05

    申请号:US17409827

    申请日:2021-08-24

    摘要: A surface mounted assembly is provided and includes a surface mounted device, a cable and a circuit board. The circuit board includes a first outer side and a second outer side opposite to first outer side, and a conductive hole structure. The cable is inserted into the conductive hole structure from the first outer side of the circuit board and affixed with and electrically connected to the conductive hole structure to locate a terminal of the cable between the first outer side and the second outer side of the circuit board. The surface mounted device is mounted on the second outer side of the circuit board. An electrical connecting component of the surface mounted device and the terminal of the cable are affixed with and electrically connected to the conductive hole structure and electrically connected to each other by the conductive hole structure. Furthermore, an endoscope is provided.