公开(公告)号：US11778785B2

公开(公告)日：2023-10-03

申请号：US17385083

申请日：2021-07-26

Applicant: Aptiv Technologies Limited

Inventor： Jochen Suck ,  Volker Klink ,  Peter Reinhold ,  Falk Rademacher

IPC: H05K7/20 ,  H01L23/373

CPC classification number: H05K7/20436 ,  H01L23/373 ,  H05K7/20136 ,  H05K7/20254

Abstract: An electronic system is described that comprises a first board and a first processing unit, wherein the first processing unit comprises a first semiconductor chip arranged on a first surface of the first board; a first cooling unit facing the first surface of the first board and configured to cool the first semiconductor chip; at least one further board and a second processing unit, wherein the second processing unit comprises a further semiconductor chip arranged on a first surface of the at least one further board; and a second cooling unit facing the first surface of the at least one further board and configured to cool the further semiconductor chip. The first board and the at least one further board are spaced apart from each other. The first cooling unit is a passive cooling unit, and the second cooling unit is an active cooling unit.

公开(公告)号：US20220087071A1

公开(公告)日：2022-03-17

申请号：US17385083

申请日：2021-07-26

Applicant: Aptiv Technologies Limited

Inventor： Jochen Suck ,  Volker Klink ,  Peter Reinhold ,  Falk Rademacher

IPC: H05K7/20 ,  H01L23/373

Abstract: An electronic system is described that comprises a first board and a first processing unit, wherein the first processing unit comprises a first semiconductor chip arranged on a first surface of the first board; a first cooling unit facing the first surface of the first board and configured to cool the first semiconductor chip; at least one further board and a second processing unit, wherein the second processing unit comprises a further semiconductor chip arranged on a first surface of the at least one further board; and a second cooling unit facing the first surface of the at least one further board and configured to cool the further semiconductor chip. The first board and the at least one further board are spaced apart from each other. The first cooling unit is a passive cooling unit, and the second cooling unit is an active cooling unit.