公开(公告)号：US20220087071A1

公开(公告)日：2022-03-17

申请号：US17385083

申请日：2021-07-26

Applicant: Aptiv Technologies Limited

Inventor： Jochen Suck ,  Volker Klink ,  Peter Reinhold ,  Falk Rademacher

IPC: H05K7/20 ,  H01L23/373

Abstract: An electronic system is described that comprises a first board and a first processing unit, wherein the first processing unit comprises a first semiconductor chip arranged on a first surface of the first board; a first cooling unit facing the first surface of the first board and configured to cool the first semiconductor chip; at least one further board and a second processing unit, wherein the second processing unit comprises a further semiconductor chip arranged on a first surface of the at least one further board; and a second cooling unit facing the first surface of the at least one further board and configured to cool the further semiconductor chip. The first board and the at least one further board are spaced apart from each other. The first cooling unit is a passive cooling unit, and the second cooling unit is an active cooling unit.

公开(公告)号：US20230292459A1

公开(公告)日：2023-09-14

申请号：US18169704

申请日：2023-02-15

Applicant: Aptiv Technologies Limited

Inventor： Falk Rademacher ,  Martin Bornemann ,  Peter Reinhold

IPC: H05K7/20 ,  H05K5/00

CPC classification number: H05K7/20218 ,  H05K5/0026

Abstract: An electronic control unit (ECU) with separable cooling and memory modules is described. The cooling module has an integrated liquid-cooling circuit with a direct connection to the cooling circuit. The memory module includes an independent memory that can store data and be tested independent of the cooling module. The cooling module and the memory module contact at thermal-contact surfaces to enable cooling when installed in a vehicle. In this way, the cooling module may provide cooling through the thermal-contact surface to one or more memory modules and the memory module may be implemented without an internal cooling system.

公开(公告)号：US20230077114A1

公开(公告)日：2023-03-09

申请号：US17930609

申请日：2022-09-08

Applicant: Aptiv Technologies Limited

Inventor： Jakub Antoni Korta ,  Tobias Richter-Brockmann ,  Peter Reinhold

IPC: H05K7/20 ,  H05K7/14 ,  H05K7/16

Abstract: A rack assembly unit for mounting a control unit to a vehicle rack system is provided; a rack chassis and a tray are configured to receive the control unit for coupling to a vehicle system. The tray is movably coupled to the rack chassis at a coupling mechanism, which provides for movement of the tray relative to the rack chassis between open and closed positions. At the open position, the tray is spaced apart from rack chassis to facilitate user access to the tray and receiving the control unit therein. At the closed position, the tray is located fully inserted relative to the rack chassis and such that the control unit located in the tray is provided at a control unit operating position thermally coupled to a cold plate of a cooling system to provide for cooling of components of the control unit.

公开(公告)号：US20220377945A1

公开(公告)日：2022-11-24

申请号：US17663988

申请日：2022-05-18

Applicant: Aptiv Technologies Limited

Inventor： Falk Rademacher ,  Peter Reinhold ,  Alf Bretschneider

IPC: H05K7/20 ,  H01L23/40

Abstract: A heat sink comprising a body non-adjustably mountable on a support provided with at least one element to be cooled, characterized in that said body comprises at least one insert that is adjustably fitted therein so that an insert contact surface comes into contact with the element to be cooled.

公开(公告)号：US11778785B2

公开(公告)日：2023-10-03

申请号：US17385083

申请日：2021-07-26

Applicant: Aptiv Technologies Limited

Inventor： Jochen Suck ,  Volker Klink ,  Peter Reinhold ,  Falk Rademacher

IPC: H05K7/20 ,  H01L23/373

CPC classification number: H05K7/20436 ,  H01L23/373 ,  H05K7/20136 ,  H05K7/20254

Abstract: An electronic system is described that comprises a first board and a first processing unit, wherein the first processing unit comprises a first semiconductor chip arranged on a first surface of the first board; a first cooling unit facing the first surface of the first board and configured to cool the first semiconductor chip; at least one further board and a second processing unit, wherein the second processing unit comprises a further semiconductor chip arranged on a first surface of the at least one further board; and a second cooling unit facing the first surface of the at least one further board and configured to cool the further semiconductor chip. The first board and the at least one further board are spaced apart from each other. The first cooling unit is a passive cooling unit, and the second cooling unit is an active cooling unit.