公开(公告)号：US20220087071A1

公开(公告)日：2022-03-17

申请号：US17385083

申请日：2021-07-26

Applicant: Aptiv Technologies Limited

Inventor： Jochen Suck ,  Volker Klink ,  Peter Reinhold ,  Falk Rademacher

IPC: H05K7/20 ,  H01L23/373

Abstract: An electronic system is described that comprises a first board and a first processing unit, wherein the first processing unit comprises a first semiconductor chip arranged on a first surface of the first board; a first cooling unit facing the first surface of the first board and configured to cool the first semiconductor chip; at least one further board and a second processing unit, wherein the second processing unit comprises a further semiconductor chip arranged on a first surface of the at least one further board; and a second cooling unit facing the first surface of the at least one further board and configured to cool the further semiconductor chip. The first board and the at least one further board are spaced apart from each other. The first cooling unit is a passive cooling unit, and the second cooling unit is an active cooling unit.

公开(公告)号：US11778785B2

公开(公告)日：2023-10-03

申请号：US17385083

申请日：2021-07-26

Applicant: Aptiv Technologies Limited

Inventor： Jochen Suck ,  Volker Klink ,  Peter Reinhold ,  Falk Rademacher

IPC: H05K7/20 ,  H01L23/373

CPC classification number: H05K7/20436 ,  H01L23/373 ,  H05K7/20136 ,  H05K7/20254

Abstract: An electronic system is described that comprises a first board and a first processing unit, wherein the first processing unit comprises a first semiconductor chip arranged on a first surface of the first board; a first cooling unit facing the first surface of the first board and configured to cool the first semiconductor chip; at least one further board and a second processing unit, wherein the second processing unit comprises a further semiconductor chip arranged on a first surface of the at least one further board; and a second cooling unit facing the first surface of the at least one further board and configured to cool the further semiconductor chip. The first board and the at least one further board are spaced apart from each other. The first cooling unit is a passive cooling unit, and the second cooling unit is an active cooling unit.

公开(公告)号：US20210195807A1

公开(公告)日：2021-06-24

申请号：US17129729

申请日：2020-12-21

Applicant: Aptiv Technologies Limited

Inventor： Volker Klink ,  Matthias Rieke ,  Falk Rademacher

IPC: H05K7/20

Abstract: The present disclosure relates to a cooling system for cooling an electronic component, the cooling system comprising a heat sink with a cooling channel for guiding a liquid. The heat sink comprises an external surface comprising at least one opening which partially exposes the cooling channel. The electronic component is mounted to the external surface such that the electronic component covers the opening. A sealing material is arranged between the electronic component and the external surface for at least partially sealing the electronic component against the liquid. The present disclosure further relates to a method for assembling a cooling system, the method comprising: forming at least one opening through an external surface of a heat sink; dispensing a sealing material in a liquid state over the external surface around the at least one opening for forming a molding; and pressing the electronic component onto the molding.

公开(公告)号：US20230292459A1

公开(公告)日：2023-09-14

申请号：US18169704

申请日：2023-02-15

Applicant: Aptiv Technologies Limited

Inventor： Falk Rademacher ,  Martin Bornemann ,  Peter Reinhold

IPC: H05K7/20 ,  H05K5/00

CPC classification number: H05K7/20218 ,  H05K5/0026

Abstract: An electronic control unit (ECU) with separable cooling and memory modules is described. The cooling module has an integrated liquid-cooling circuit with a direct connection to the cooling circuit. The memory module includes an independent memory that can store data and be tested independent of the cooling module. The cooling module and the memory module contact at thermal-contact surfaces to enable cooling when installed in a vehicle. In this way, the cooling module may provide cooling through the thermal-contact surface to one or more memory modules and the memory module may be implemented without an internal cooling system.

公开(公告)号：US20230090833A1

公开(公告)日：2023-03-23

申请号：US17932564

申请日：2022-09-15

Applicant: Aptiv Technologies Limited

Inventor： Frank H. Adam ,  Falk Rademacher

IPC: H05K1/02

Abstract: Disclosed are aspects of apparatuses and methods of fitting a cooling device to a circuit board for cooling a high-power electronic component mounted on the circuit board. Cooling apparatuses, and arrangement thereof, are also described. The method provides the cooling device with a cooling surface having a cooling area for thermally connecting to a to-be-cooled surface of the electronic component. Fixing elements are provided for moving the cooling surface towards the circuit board. A distance position “d” of the to-be-cooled surface from the circuit board is determined, and on this basis spacer elements are selected to be interposed between the cooling device and the circuit board to limit the movement by the fixing elements to a position where the cooling area is in proximity to the to-be-cooled surface.

公开(公告)号：US20220377945A1

公开(公告)日：2022-11-24

申请号：US17663988

申请日：2022-05-18

Applicant: Aptiv Technologies Limited

Inventor： Falk Rademacher ,  Peter Reinhold ,  Alf Bretschneider

IPC: H05K7/20 ,  H01L23/40

Abstract: A heat sink comprising a body non-adjustably mountable on a support provided with at least one element to be cooled, characterized in that said body comprises at least one insert that is adjustably fitted therein so that an insert contact surface comes into contact with the element to be cooled.