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公开(公告)号:US10665591B2
公开(公告)日:2020-05-26
申请号:US16122752
申请日:2018-09-05
申请人: Arm Limited
IPC分类号: H01L27/092 , H01L29/78 , H01L21/8238 , G11C11/40 , H03K3/012
摘要: Briefly, embodiments of claimed subject matter relate to devices and methods for modifying, such as decreasing rise time and/or fall time, of a driver signal output. To achieve such modifications in driver output signals, additional gates may be positioned at PMOS and/or NMOS regions of a semiconductor film. In addition, at least in particular embodiments, etching of portions of one or more semiconductor regions may increase compressive or tensile stress, which may further operate to modify driver output signals.
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公开(公告)号:US20200075591A1
公开(公告)日:2020-03-05
申请号:US16122752
申请日:2018-09-05
申请人: Arm Limited
IPC分类号: H01L27/092 , H01L29/78 , H03K3/012 , G11C11/40 , H01L21/8238
摘要: Briefly, embodiments of claimed subject matter relate to devices and methods for modifying, such as decreasing rise time and/or fall time, of a driver signal output. To achieve such modifications in driver output signals, additional gates may be positioned at PMOS and/or NMOS regions of a semiconductor film. In addition, at least in particular embodiments, etching of portions of one or more semiconductor regions may increase compressive or tensile stress, which may further operate to modify driver output signals.
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公开(公告)号:US11145651B2
公开(公告)日:2021-10-12
申请号:US16882634
申请日:2020-05-25
申请人: Arm Limited
IPC分类号: H01L27/092 , H01L29/78 , H01L21/8238 , G11C11/40 , H03K3/012
摘要: Briefly, embodiments of claimed subject matter relate to devices and methods for modifying, such as decreasing rise time and/or fall time, of a driver signal output. To achieve such modifications in driver output signals, additional gates may be positioned at PMOS and/or NMOS regions of a semiconductor film. In addition, at least in particular embodiments, etching of portions of one or more semiconductor regions may increase compressive or tensile stress, which may further operate to modify driver output signals.
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公开(公告)号:US20200286888A1
公开(公告)日:2020-09-10
申请号:US16882634
申请日:2020-05-25
申请人: Arm Limited
IPC分类号: H01L27/092 , H01L29/78 , H01L21/8238 , G11C11/40 , H03K3/012
摘要: Briefly, embodiments of claimed subject matter relate to devices and methods for modifying, such as decreasing rise time and/or fall time, of a driver signal output. To achieve such modifications in driver output signals, additional gates may be positioned at PMOS and/or NMOS regions of a semiconductor film. In addition, at least in particular embodiments, etching of portions of one or more semiconductor regions may increase compressive or tensile stress, which may further operate to modify driver output signals.
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