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公开(公告)号：US06740945B2
公开(公告)日：2004-05-25
申请号：US10175700
申请日：2002-06-20
IPC分类号： H01L2714
CPC分类号： G06K9/00053
摘要： A structure and method for creating a contact between a conductive layer and a pad for dissipating electrostatic charges comprising the steps of, forming a pad and a composite insulating layer between and over conductive plates on a substrate, wherein the insulating layer isolates and protects the conductive plates and pad from damage, the insulating layer comprising a dielectric region underlying a conductive layer. A passivation layer is formed over at least a portion of the conductive layer and a photoresist is patterned over at least a portion of the passivation. An opening is etched through the passivation and the insulating layers, wherein the photoresist and the conductive layer serve as masks. Finally, a conductive material is deposited in the opening to form an electrical contact between the pad and the conductive layer.
摘要翻译： 一种用于在导电层和用于消散静电荷的焊盘之间产生接触的结构和方法，包括以下步骤：在衬底上的导电板之间和之上形成衬垫和复合绝缘层，其中绝缘层隔离并保护导电 板和垫从损坏中，绝缘层包括导电层下面的电介质区域。 在导电层的至少一部分上形成钝化层，并且在至少一部分钝化层上形成光刻胶。 通过钝化和绝缘层蚀刻开口，其中光致抗蚀剂和导电层用作掩模。 最后，导电材料沉积在开口中以在焊盘和导电层之间形成电接触。
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公开(公告)号：US06330145B1
公开(公告)日：2001-12-11
申请号：US09223346
申请日：1998-12-30
IPC分类号： G06K928
CPC分类号： G06K9/00053
摘要： A structure and method is disclosed for grounding an electrostatic discharge device of an integrated circuit to dissipate electrostatic charges comprising an underlying dielectric layer disposed over capacitor plates of sensor circuitry and a conductive layer disposed over the underlying dielectric layer, wherein the conductive layer diffuses electrostatic charges at the surface of the integrated circuit to ground. The conductive material not only dissipates electrostatic charges to the ground, but may also protect at least a portion of the edge of the sensor chip from mechanical stress.
摘要翻译： 公开了一种用于使集成电路的静电放电装置接地以消散静电电荷的结构和方法，该静电电荷包括设置在传感器电路的电容器板上的下面的介电层和设置在下面的介电层上的导电层，其中导电层扩散静电电荷 在集成电路的表面接地。 导电材料不仅将静电电荷耗散到地面，而且还可以保护传感器芯片的边缘的至少一部分免受机械应力。
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公开(公告)号：US06478976B1
公开(公告)日：2002-11-12
申请号：US09224815
申请日：1998-12-30
IPC分类号： H01L2100
CPC分类号： G06K9/00053
摘要： A structure and method for creating a contact between a conductive layer and a pad for dissipating electrostatic charges comprising the steps of, forming a pad and a composite insulating layer between and over conductive plates on a substrate, wherein the insulating layer isolates and protects the conductive plates and pad from damage, the insulating layer comprising a dielectric region underlying a conductive layer. A passivation layer is formed over at least a portion of the conductive layer and a photoresist is patterned over at least a portion of the passivation. An opening is etched through the passivation and the insulating layers, wherein the photoresist and the conductive layer serve as masks. Finally, a conductive material is deposited in the opening to form an electrical contact between the pad and the conductive layer.
摘要翻译： 一种用于在导电层和用于消散静电荷的焊盘之间产生接触的结构和方法，包括以下步骤：在衬底上的导电板之间和之上形成衬垫和复合绝缘层，其中绝缘层隔离并保护导电 板和垫从损坏中，绝缘层包括导电层下面的电介质区域。 在导电层的至少一部分上形成钝化层，并且在至少一部分钝化层上形成光刻胶。 通过钝化和绝缘层蚀刻开口，其中光致抗蚀剂和导电层用作掩模。 最后，导电材料沉积在开口中以在焊盘和导电层之间形成电接触。
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公开(公告)号：US06555888B2
公开(公告)日：2003-04-29
申请号：US10186801
申请日：2002-07-01
IPC分类号： H01L2982
CPC分类号： G06K9/00053
摘要： A structure and method is disclosed for dissipating electrostatic charges comprising an underlying dielectric layer disposed over capacitor plates of sensor circuitry, and a conductive layer and passivation layers disposed over the underlying dielectric layer wherein the conductive layer diffuses electrostatic charges at the surface of the integrated circuit.
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公开(公告)号：US06440814B1
公开(公告)日：2002-08-27
申请号：US09223629
申请日：1998-12-30
IPC分类号： H01L2120
CPC分类号： G06K9/00053
摘要： A structure and method is disclosed for dissipating electrostatic charges comprising an underlying dielectric layer disposed over capacitor plates of sensor circuitry, and a conductive layer and passivation layers disposed over the underlying dielectric layer wherein the conductive layer diffuses electrostatic charges at the surface of the integrated circuit.
摘要翻译： 公开了用于耗散静电电荷的结构和方法，该静电电荷包括设置在传感器电路的电容器板上的下面的介电层，以及设置在下面的介电层上的导电层和钝化层，其中导电层在集成电路的表面扩散静电电荷 。
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公开(公告)号：US06346739B1
公开(公告)日：2002-02-12
申请号：US09223706
申请日：1998-12-30
IPC分类号： H01L2900
CPC分类号： G06K9/00053
摘要： A structure and method for dissipating charges comprising an underlying dielectric layer disposed over capacitor plates of sensor circuitry, and a conductive path and passivation layers disposed over the underlying dielectric layer wherein the conductive pad forms an electrically conductive path over at least a portion of the plates and diffuses electrostatic charges at the surface of the integrated circuit.
摘要翻译： 用于耗散电荷的结构和方法，包括设置在传感器电路的电容器板上的下面的介电层，以及设置在下面的介电层之上的导电路径和钝化层，其中导电焊盘在至少一部分板上形成导电路径 并在集成电路的表面扩散静电电荷。
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公开(公告)号：US06737329B2
公开(公告)日：2004-05-18
申请号：US10040861
申请日：2001-11-02
IPC分类号： H01L2120
CPC分类号： G06K9/00053
摘要： A structure and method for dissipating charges comprising an underlying dielectric layer disposed over capacitor plates of sensor circuitry, and a conductive path and passivation layers disposed over the underlying dielectric layer wherein the conductive pad forms an electrically conductive path over at least a portion of the plates and diffuses electrostatic charges at the surface of the integrated circuit.
摘要翻译： 用于耗散电荷的结构和方法，包括设置在传感器电路的电容器板上的下面的介电层，以及设置在下面的介电层之上的导电路径和钝化层，其中导电焊盘在至少一部分板上形成导电路径 并在集成电路的表面扩散静电电荷。
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