公开(公告)号：US20180339936A1

公开(公告)日：2018-11-29

申请号：US15989934

申请日：2018-05-25

申请人： Asahi Glass Company, Limited

发明人： Motoshi Ono ,  Mamoru Isobe ,  Shigetoshi Mori ,  Kohei Horiuchi

IPC分类号： C03C15/00 ,  H05K3/00 ,  C03C23/00 ,  B23K26/00 ,  B23K26/382

摘要： A manufacturing method of a glass substrate having through holes includes (i) irradiating at a through hole forming target position on a first surface of the glass substrate with a laser light; and (ii) performing a wet etching treatment on the glass substrate. During the wet etching treatment being performed on the glass substrate, an ultrasonic vibration with a frequency of less than 40 kHz is applied to an etchant over at least a part of the wet etching period, referred to as an ultrasonic vibration application period.