MAGNETIC SENSOR MODULE
    2.
    发明申请

    公开(公告)号:US20200326399A1

    公开(公告)日:2020-10-15

    申请号:US16912718

    申请日:2020-06-26

    摘要: An object is to provide a magnetic sensor module reducing influence of heat generated from a coil on a magnetic sensor. A conventional method requires, on a magnetic sensor chip, multiple temperature measuring circuits corresponding to multiple magnetic sensors, and many pads for connection to an IC chip. Therefore, the problem is increase in size of the sensor chip mounting the sensors and in manufacturing cost. Provided is a magnetic sensor module comprising an IC chip including a first coil, a first pad connected to one end of the coil, and a second pad to the other end; a magnetic sensor chip disposed on the IC chip's surface, including a first magnetic sensor detecting first axial magnetism; a first external output terminal; a first conductive wire for connecting the first pad and terminal; a second external output terminal; and a second conductive wire for connecting the second pad and terminal.

    APPARATUS FOR INPUTTING SIGNAL FROM COMMUNICATION LINE AND METHOD THEREOF

    公开(公告)号:US20240213970A1

    公开(公告)日:2024-06-27

    申请号:US18391720

    申请日:2023-12-21

    IPC分类号: H03K5/24 H03K3/037

    CPC分类号: H03K5/24 H03K3/037

    摘要: Provided is an apparatus including: a first input circuit which inputs signal from a first communication line; a second input circuit which inputs a signal from a second communication line; a reference voltage generation circuit which generates a reference voltage; and a comparison circuit which compares the reference voltage with a voltage of the first communication line. The first input circuit and the second input circuit adjust judgement thresholds to be used for judging a signal value according to the comparison result obtained by the comparison circuit.