公开(公告)号：US09680042B2

公开(公告)日：2017-06-13

申请号：US14650342

申请日：2013-12-16

申请人： Atotech Deutschland GmbH

发明人： Torsten Voss ,  Sven Lamprecht

IPC分类号： H01L21/00 ,  H01L31/05

CPC分类号： H01L31/0516 ,  H01L31/0508 ,  H01L31/0512 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/3512 ,  Y02E10/50

摘要： The present invention concerns a plating method for manufacturing of electrical contacts on a solar module wherein the wiring between silicon solar cells in a solar module is deposited by electroplating onto a conductive seed. The wiring between individual silicon solar cells comprises wiring reinforcement pillars which improve the reliability of said wiring.