公开(公告)号：US20230313401A1

公开(公告)日：2023-10-05

申请号：US18002918

申请日：2021-06-29

申请人： Atotech Deutschland GmbH & Co. KG

发明人： Heiko BRUNNER ,  Sandra HEYDE ,  Peter HAACK ,  Angela LLAVONA-SERRANO

IPC分类号： C25D3/38 ,  C25D5/02

CPC分类号： C25D3/38 ,  C25D5/02

摘要： The invention relates to aqueous acidic plating baths for electrodeposition of copper and copper alloys in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.