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公开(公告)号：US20230313401A1
公开(公告)日：2023-10-05
申请号：US18002918
申请日：2021-06-29
摘要： The invention relates to aqueous acidic plating baths for electrodeposition of copper and copper alloys in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.
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2.发明公开公开(公告)号：US20230220558A1
公开(公告)日：2023-07-13
申请号：US18000480
申请日：2021-06-10
发明人： Lars KOHLMANN , Heiko BRUNNER
摘要： An aqueous etching composition comprising:
(a) functionalized urea, biuret and guanidine derivatives and/or salts thereof selected from compounds having formulae I or II:
wherein
X and Y are independently selected from oxygen, NRR′ and NR5,
R, R′ and R5 are independently selected from R1, hydrogen, polyethylene glycols, aromatic compounds, and C1-C4 alkyl, wherein the aromatic compounds and C1-C4 alkyl optionally comprise at least one substituent selected as OR6,
R6 is selected from hydrogen and C1-C4alkyl,
X and Y can be identical or different;
R1 and R2 are independently selected from hydrogen, alkyl compounds, amines, and nitrogen-comprising heteroaromatic compounds,
R1 and R2 can be identical or different, with the proviso that R1 cannot be hydrogen,
and with the proviso that in compounds having formula I R1 cannot be hydrogen or alkyl compound if X is oxygen;
m is an integer from 1 to 4, and
n is an integer from 0 to 8;
wherein m and n can be identical or different;
(b) an oxidizing agent; and
wherein the composition comprises a pH from 7.1 to 14.
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