Chip type solid electrolytic capacitor
    1.
    发明授权
    Chip type solid electrolytic capacitor 失效
    片式固体电解电容器

    公开(公告)号:US06229688B1

    公开(公告)日:2001-05-08

    申请号:US09639327

    申请日:2000-08-16

    IPC分类号: H01G900

    CPC分类号: H01G9/15 H01G9/0003

    摘要: A water vapor discharge passage 10 formed of fine porous fluorocarbon resin having high water vapor permeability is provided in a chip type solid electrolytic capacitor having a capacitor element 1 and an anode terminal 2 and a cathode terminal 3 for external electric connection and encapsulated in a mold resin 4. The water vapor discharge passage communicates an interior of the capacitor element with atmosphere.

    摘要翻译: 在具有电容器元件1和阳极端子2的芯片型固体电解电容器和用于外部电连接的阴极端子3的芯片型固体电解电容器中设置由具有高透水性的微细多孔碳氟树脂形成的水蒸气放电通道10, 水蒸汽排放通道将电容器元件的内部与大气连通。

    Process for manufacturing a molded electronic component having
pre-plated lead terminals
    2.
    发明授权
    Process for manufacturing a molded electronic component having pre-plated lead terminals 失效
    制造具有预镀铅引线端子的模制电子部件的工艺

    公开(公告)号:US6127205A

    公开(公告)日:2000-10-03

    申请号:US901239

    申请日:1997-07-25

    摘要: A process for manufacturing a molded elecronic component such as a solid electrolyte capacitor comprising a capacitor element including a cathode layer, an anode lead, a pre-plated anode lead terminal connected to the anode lead, a pre-plated cathode lead terminal connected to the cathode layer, and an insulating member which encapsulates the capacitor element and leaves a portion of the anode and cathode lead terminals exposed. The encapsulated portions of the pre-plated anode and cathode lead terminals have a plating layer formed thereon containing organic substances in an amount of 0.03 wt. % or less.

    摘要翻译: 一种用于制造诸如固体电解质电容器的模制电子部件的方法,包括电容器元件,电容器元件包括阴极层,阳极引线,连接到阳极引线的预镀阳极引线端子,连接到阳极引线的预镀阴极引线端子 阴极层和封装电容器元件并使阳极和阴极引线端子的一部分露出的绝缘构件。 预镀阳极和阴极引线端子的封装部分具有形成在其上的镀层,其上含有0.03重量%的有机物质。 % 或更少。

    Molded electronic component having pre-plated lead terminals and manufacturing process thereof
    3.
    发明授权
    Molded electronic component having pre-plated lead terminals and manufacturing process thereof 有权
    具有预镀铅引线端子的成型电子部件及其制造方法

    公开(公告)号:US06294826B1

    公开(公告)日:2001-09-25

    申请号:US09639821

    申请日:2000-08-17

    IPC分类号: H01L23495

    摘要: A molded elecronic component such as a solid electrolyte capacitor comprising a capacitor element including a cathode layer, an anode lead, a pre-plated anode lead terminal connected to the anode lead, a pre-plated cathode lead terminal connected to the cathode layer, and an insulating member which encapsulates the capacitor element and leaves a portion of the anode and cathode lead terminals exposed. The encapsulated portions of the pre-plated anode and cathode lead terminals have a plating layer formed thereon containing organic substances in an amount of 0.03 wt. % or less. Also disclosed is a process for manufacturing the solid electrolyte capacitor.

    摘要翻译: 一种模制电子部件,例如固体电解质电容器,其包括电容器元件,电容器元件包括阴极层,阳极引线,连接到阳极引线的预镀阳极引线端子,连接到阴极层的预镀阴极引线端子,以及 绝缘构件,其封装电容器元件并使暴露的阳极和阴极引线端子的一部分离开。 预镀阳极和阴极引线端子的封装部分具有形成在其上的镀层,其上含有0.03重量%的有机物质。 % 或更少。 还公开了一种制造固体电解电容器的方法。