公开(公告)号：US06183885B2

公开(公告)日：2001-02-06

申请号：US09061179

申请日：1998-04-17

申请人： Atsushi Nakamura ,  Jun Shioya ,  Atsuhiko Fujii ,  Nobuaki Isono ,  Yasuhiro Shintani ,  Masahiro Kawaguchi

发明人： Atsushi Nakamura ,  Jun Shioya ,  Atsuhiko Fujii ,  Nobuaki Isono ,  Yasuhiro Shintani ,  Masahiro Kawaguchi

IPC分类号： H01R1303

CPC分类号： H01R13/03 ,  Y10S428/929 ,  Y10T428/12715 ,  Y10T428/12722

摘要： There is disclosed a fitting-type connection terminal in which an insertion force for a terminal can be reduced while maintaining a stable contact resistance. If the thickness of a tin film on one of male and female terminals is 0.1 &mgr;m to 0.3 &mgr;m while the thickness of a tin film on the other terminal is not less than 0.1 &mgr;m, the hardness of the terminal is increasingly influenced by the hardness of a base material (of copper or copper alloy) with the decrease of the thickness of the tin film, so that the apparent hardness of the terminal increases. As a result, the adhesion of the tin film is suppressed, and the terminal insertion force can be reduced at least by more than 10% as compared with a reference value (1.0 &mgr;m for each of the male and female terminals). Particularly if the thickness of the tin film on the male terminal 10 is 0.1 &mgr;m while the thickness of the tin film on the female terminal 20 is 0.3 &mgr;m to 1.0 &mgr;m, the insertion force can be reduced by more than 30%.

摘要翻译： 公开了一种装配型连接端子，其中可以在保持稳定的接触电阻的同时减小端子的插入力。 如果阳端子和母端子之间的锡膜的厚度为0.1μm至0.3μm，而另一端子上的锡膜的厚度不小于0.1μm，则端子的硬度越来越受硬度的影响 铜或铜合金的基体材料，随着锡膜厚度的减小，端子的表观硬度增加。 结果，抑制了锡膜的粘合，并且与基准值（每个阳，阴端子为1.0μm）相比，端子插入力可以至少降低10％以上。 特别是如果阳端子10上的锡膜的厚度为0.1μm，而母端子20上的锡膜的厚度为0.3μm〜1.0μm，则插入力可以降低30％以上。