公开(公告)号：US06183885B2

公开(公告)日：2001-02-06

申请号：US09061179

申请日：1998-04-17

申请人： Atsushi Nakamura ,  Jun Shioya ,  Atsuhiko Fujii ,  Nobuaki Isono ,  Yasuhiro Shintani ,  Masahiro Kawaguchi

发明人： Atsushi Nakamura ,  Jun Shioya ,  Atsuhiko Fujii ,  Nobuaki Isono ,  Yasuhiro Shintani ,  Masahiro Kawaguchi

IPC分类号： H01R1303

CPC分类号： H01R13/03 ,  Y10S428/929 ,  Y10T428/12715 ,  Y10T428/12722

摘要： There is disclosed a fitting-type connection terminal in which an insertion force for a terminal can be reduced while maintaining a stable contact resistance. If the thickness of a tin film on one of male and female terminals is 0.1 &mgr;m to 0.3 &mgr;m while the thickness of a tin film on the other terminal is not less than 0.1 &mgr;m, the hardness of the terminal is increasingly influenced by the hardness of a base material (of copper or copper alloy) with the decrease of the thickness of the tin film, so that the apparent hardness of the terminal increases. As a result, the adhesion of the tin film is suppressed, and the terminal insertion force can be reduced at least by more than 10% as compared with a reference value (1.0 &mgr;m for each of the male and female terminals). Particularly if the thickness of the tin film on the male terminal 10 is 0.1 &mgr;m while the thickness of the tin film on the female terminal 20 is 0.3 &mgr;m to 1.0 &mgr;m, the insertion force can be reduced by more than 30%.

摘要翻译： 公开了一种装配型连接端子，其中可以在保持稳定的接触电阻的同时减小端子的插入力。 如果阳端子和母端子之间的锡膜的厚度为0.1μm至0.3μm，而另一端子上的锡膜的厚度不小于0.1μm，则端子的硬度越来越受硬度的影响 铜或铜合金的基体材料，随着锡膜厚度的减小，端子的表观硬度增加。 结果，抑制了锡膜的粘合，并且与基准值（每个阳，阴端子为1.0μm）相比，端子插入力可以至少降低10％以上。 特别是如果阳端子10上的锡膜的厚度为0.1μm，而母端子20上的锡膜的厚度为0.3μm〜1.0μm，则插入力可以降低30％以上。

公开(公告)号：US06939621B2

公开(公告)日：2005-09-06

申请号：US10849155

申请日：2004-05-20

申请人： Toshihisa Hara ,  Yasuhiro Shintani ,  Masayasu Nishimura ,  Ryoichi Ozaki ,  Masahiro Kawaguchi

发明人： Toshihisa Hara ,  Yasuhiro Shintani ,  Masayasu Nishimura ,  Ryoichi Ozaki ,  Masahiro Kawaguchi

IPC分类号： C23C26/00 ,  C23C28/02 ,  C25D5/12 ,  H05K3/24 ,  B32B15/20 ,  C25D3/30 ,  C25D5/50

CPC分类号： C23C28/021 ,  C23C26/00 ,  C23C28/023 ,  C25D5/12 ,  H05K3/244 ,  Y10S428/929 ,  Y10S428/935 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/1291

摘要： A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 μm. The copper-tin alloy layer has a thickness of 0.1-1.0 μm and contains 35-75 at % of copper. The material may additionally have a tin layer no thicker than 0.5 μm for an engaging type terminal containing 0.001-0.1 mass % of carbon, or thicker than 0.5 μm for a non-engaging type connector. The material meets requirements for capability of insertion with a small force, good electric reliability (due to low contact resistance) in a high-temperature atmosphere, workability for sharp bending without cracking, good solder wettability and good corrosion resistance to sulfur dioxide gas.

摘要翻译： 提供一种用于连接端子的电镀铜合金材料，其包括铜或铜合金的母体材料，镍层和铜 - 锡合金层。 镍层的厚度为0.1-1.0μm。 铜 - 锡合金层的厚度为0.1-1.0μm，含有35-75at％的铜。 对于非接合型连接器，对于含有0.001-0.1质量％的碳或大于0.5μm的接合型端子，该材料可另外具有不超过0.5μm的锡层。 该材料在高温环境下能够以较小的力，良好的电气可靠性（由于接触电阻低）而满足对插入能力的要求，无裂纹的急剧弯曲的可加工性，良好的焊料润湿性和对二氧化硫气体的良好的耐腐蚀性。

公开(公告)号：US06759142B2

公开(公告)日：2004-07-06

申请号：US10207027

申请日：2002-07-30

申请人： Toshihisa Hara ,  Yasuhiro Shintani ,  Masayasu Nishimura ,  Ryoichi Ozaki ,  Masahiro Kawaguchi

发明人： Toshihisa Hara ,  Yasuhiro Shintani ,  Masayasu Nishimura ,  Ryoichi Ozaki ,  Masahiro Kawaguchi

IPC分类号： B32B1520

CPC分类号： C23C28/021 ,  C23C26/00 ,  C23C28/023 ,  C25D5/12 ,  H05K3/244 ,  Y10S428/929 ,  Y10S428/935 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/1291

摘要： A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 &mgr;m. The copper-tin alloy layer has a thickness of 0.1-1.0 &mgr;m and contains 35-75 at % of copper. The material may additionally have a tin layer no thicker than 0.5 &mgr;m for an engaging type terminal containing 0.001-0.1 mass % of carbon, or thicker than 0.5 &mgr;m for a non-engaging type connector. The material meets requirements for capability of insertion with a small force, good electric reliability (due to low contact resistance) in a high-temperature atmosphere, workability for sharp bending without cracking, good solder wettability and good corrosion resistance to sulfur dioxide gas.

摘要翻译： 提供一种用于连接端子的电镀铜合金材料，其包括铜或铜合金的母体材料，镍层和铜 - 锡合金层。 镍层的厚度为0.1-1.0μm。 铜 - 锡合金层的厚度为0.1-1.0μm，含有35-75at％的铜。 对于非接合型连接器，对于含有0.001-0.1质量％的碳或大于0.5μm的接合型端子，该材料可另外具有不超过0.5μm的锡层。 该材料在高温环境下能够以较小的力，良好的电气可靠性（由于接触电阻低）而满足对插入能力的要求，无裂纹的急剧弯曲的可加工性，良好的焊料润湿性和对二氧化硫气体的良好的耐腐蚀性。