公开(公告)号：US11764229B2

公开(公告)日：2023-09-19

申请号：US17359649

申请日：2021-06-28

Applicant: Au Optronics Corporation

Inventor： Hsiu-Chun Hsieh ,  Hsin-Hung Sung ,  Shu-Hui Huang ,  Chih-Chung Su ,  Yi-Wei Chen ,  Fang-Hui Chan

IPC: H01L27/12 ,  H01L25/16

CPC classification number: H01L27/124 ,  H01L25/167

Abstract: A pixel array substrate, including a substrate, multiple conductors, a pixel driving circuit, a first pad, and a second pad, is provided. The substrate has a first surface, a second surface, and multiple through holes. The through holes extend from the first surface to the second surface. The conductors are respectively disposed in the through holes. The pixel driving circuit is disposed on the first surface of the substrate. The first pad and the second pad are disposed on the second surface of the substrate. The conductors include a first conductor, a second conductor, and a first dummy conductor. The first conductor is electrically connected to the pixel driving circuit and the first pad. The second conductor is electrically connected to the pixel driving circuit and the second pad. The first dummy conductor is overlapped with and electrically isolated from the pixel driving circuit.

公开(公告)号：US20220254968A1

公开(公告)日：2022-08-11

申请号：US17371069

申请日：2021-07-08

Applicant: Au Optronics Corporation

Inventor： Hsin-Hung Sung ,  Yi-Wei Chen

IPC: H01L33/62 ,  H01L33/00

Abstract: An electronic device, including an active device substrate, an insulation film, a vertical wire, and an anisotropic conductive adhesive, is provided. The active device substrate includes a substrate, a first wire, and a second wire. The first wire is configured on a first surface of the substrate, the second wire is configured on a second surface of the substrate, and a side surface connects the first surface to the second surface that is opposite to the first surface. The insulation film is configured on the side surface of the substrate. The vertical wire is configured on a surface of the insulation film and is located between the insulation film and the side surface of the substrate. The anisotropic conductive adhesive is configured between the vertical wire and the side surface of the substrate and electrically connects the vertical wire to the first wire and the second wire.

公开(公告)号：US12107202B2

公开(公告)日：2024-10-01

申请号：US17371069

申请日：2021-07-08

Applicant: Au Optronics Corporation

Inventor： Hsin-Hung Sung ,  Yi-Wei Chen

IPC: H01L33/62 ,  H01L33/00

CPC classification number: H01L33/62 ,  H01L33/005 ,  H01L2933/0066

Abstract: An electronic device, including an active device substrate, an insulation film, a vertical wire, and an anisotropic conductive adhesive, is provided. The active device substrate includes a substrate, a first wire, and a second wire. The first wire is configured on a first surface of the substrate, the second wire is configured on a second surface of the substrate, and a side surface connects the first surface to the second surface that is opposite to the first surface. The insulation film is configured on the side surface of the substrate. The vertical wire is configured on a surface of the insulation film and is located between the insulation film and the side surface of the substrate. The anisotropic conductive adhesive is configured between the vertical wire and the side surface of the substrate and electrically connects the vertical wire to the first wire and the second wire.

公开(公告)号：US20220165755A1

公开(公告)日：2022-05-26

申请号：US17359649

申请日：2021-06-28

Applicant: Au Optronics Corporation

Inventor： Hsiu-Chun Hsieh ,  Hsin-Hung Sung ,  Shu-Hui Huang ,  Chih-Chung Su ,  Yi-Wei Chen ,  Fang-Hui Chan

IPC: H01L27/12 ,  H01L25/16

Abstract: A pixel array substrate, including a substrate, multiple conductors, a pixel driving circuit, a first pad, and a second pad, is provided. The substrate has a first surface, a second surface, and multiple through holes. The through holes extend from the first surface to the second surface. The conductors are respectively disposed in the through holes. The pixel driving circuit is disposed on the first surface of the substrate. The first pad and the second pad are disposed on the second surface of the substrate. The conductors include a first conductor, a second conductor, and a first dummy conductor. The first conductor is electrically connected to the pixel driving circuit and the first pad. The second conductor is electrically connected to the pixel driving circuit and the second pad. The first dummy conductor is overlapped with and electrically isolated from the pixel driving circuit.