公开(公告)号：US20250077755A1

公开(公告)日：2025-03-06

申请号：US18456648

申请日：2023-08-28

Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.

Inventor： David D. Moser ,  Daniel L. Stanley ,  Jane O. Gilliam

IPC: G06F30/343

Abstract: A semiconductor device includes a data port, a programmable logic block for executing a manufacturer test, and a processor operatively coupled to the data port. The processor is configured to assert, in a first modality, a configuration isolation signal to the data port. The data port is configured to be communicatively isolated from the programmable logic block while the configuration isolation signal is asserted. The processor is configured to de-assert, in a second modality, the configuration isolation signal from the data port. The data port is configured to be communicatively coupled to the programmable logic block while the configuration isolation signal is de-asserted. In some examples, the semiconductor device includes a communication interface communicatively coupled to the programmable logic block, wherein the processor is further configured to cause, in the first modality, data to be loaded into the programmable logic block from a first-in-first-out (FIFO) buffer of the communication interface.

公开(公告)号：US20200373286A1

公开(公告)日：2020-11-26

申请号：US16422072

申请日：2019-05-24

Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.

Inventor： Lori D. Dennis ,  Jamie A. Bernard ,  Alan F. Dennis ,  Jane O. Gilliam ,  Jason F. Ross ,  Keith K. Sturcken ,  Dale A Rickard

IPC: H01L25/16 ,  H01L23/538 ,  H01L23/00 ,  H01L23/64 ,  H01L25/00 ,  H01L23/498 ,  H01L23/367

Abstract: A multi-chip module hybrid integrated circuit (MCM-HIC) provides cold spare support to an apparatus comprising a plurality of ICs and/or other circuits that are not cold spare compliant. At least one core IC and at least one cold spare chiplet are installed on an interconnecting substrate having a plurality of power zones to which power can be applied and withdrawn as needed. When powered, the cold spare chiplets serve as mediators and interfaces between the non cold spare compliant circuits. When the cold spare chiplets are at least partly unpowered, they protect all interconnected circuits, and ensure that interconnected circuits that remain powered are not hindered by unpowered interconnected circuits. Cold spare chiplets can extend across boundaries between power zones. External circuits can be exclusively interfaced to a subset of the power zones. Separate power circuits within a power zone can be sequenced during application and withdrawal of power.

公开(公告)号：US10854586B1

公开(公告)日：2020-12-01

申请号：US16422072

申请日：2019-05-24

Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.

Inventor： Lori D. Dennis ,  Jamie A. Bernard ,  Alan F. Dennis ,  Jane O. Gilliam ,  Jason F. Ross ,  Keith K. Sturcken ,  Dale A Rickard

IPC: G06N20/00 ,  G06F11/07 ,  H01L25/16 ,  H01L23/538 ,  H01L23/00 ,  H01L23/64 ,  H01L25/00 ,  H01L23/498 ,  H01L23/367

Abstract: A multi-chip module hybrid integrated circuit (MCM-HIC) provides cold spare support to an apparatus comprising a plurality of ICs and/or other circuits that are not cold spare compliant. At least one core IC and at least one cold spare chiplet are installed on an interconnecting substrate having a plurality of power zones to which power can be applied and withdrawn as needed. When powered, the cold spare chiplets serve as mediators and interfaces between the non cold spare compliant circuits. When the cold spare chiplets are at least partly unpowered, they protect all interconnected circuits, and ensure that interconnected circuits that remain powered are not hindered by unpowered interconnected circuits. Cold spare chiplets can extend across boundaries between power zones. External circuits can be exclusively interfaced to a subset of the power zones. Separate power circuits within a power zone can be sequenced during application and withdrawal of power.