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公开(公告)号：US12238905B2
公开(公告)日：2025-02-25
申请号：US18067041
申请日：2022-12-16
Applicant: BAE Systems Controls Inc.
Inventor： Stephen J. Kosteva , Cameron R. Vakili , Leslie R. Baker , Stephen L. Homan
IPC: H05K7/20
Abstract: A cooling system and method for cooling a contactor from the contactor-terminal side or both the contactor-mount side is provided. The contactors may be mounted to a base of a chassis. The cover may have one or more fluid channels associated with an exterior side of the cover. The interior side may have a plurality of thermally conductive bosses projecting from the interior surface configured to indirectly contact busbars which are respectively connected to contactor terminals of the contactors via thermal pads to provide a heat transfer path between the busbars and the fluid within the one or more fluid channels associated with the exterior side of the cover. Certain of the thermally conductive bosses are offset from the one or more fluid channels.
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Patent Agency Ranking
公开(公告)号：US20240204624A1
公开(公告)日：2024-06-20
申请号：US18067026
申请日：2022-12-16
Applicant: BAE Systems Controls Inc.
Inventor： Arthur P. Lyons , Stephen J. Kosteva , Cameron R. Vakili , Nicholas A. Lemberg , Robert J. Vovos
Abstract: A cabling system having a shielded cable for connecting an inverter and an electric machine is provided. The conductive shielding is connectable, either directly or indirectly, to the chassis of the inverter and the chassis of the electric machine such as indirectly, via a cable connector chassis. The cabling system further comprise high pass filter which comprises capacitance electrically connected to the conductive shielding configured to attenuated current less than a predetermined frequency from coupling to the conductive shielding. The attenuation is achieved via a frequency dependent current limiting impedance of the capacitance. The current less than the predetermined frequency is caused by torque producing current and/or flux modifying current. The cable connector chassis may comprise at least one high pass filter to connect serially with at least one cable inserted therein, respectively.
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公开(公告)号：US12238904B2
公开(公告)日：2025-02-25
申请号：US18067025
申请日：2022-12-16
Applicant: BAE Systems Controls Inc.
Inventor： Stephen J. Kosteva , Cameron R. Vakili , Leslie R. Baker , Stephen L. Homan
Abstract: A cooling system for a modular power control system (MPCS) is provided. The MPCS comprises modules. Each module has a chassis with a first manifold segment for first common manifold and a second manifold segment for second common manifold. When the modules are mounts to each other, the first manifold segments align to form the first common manifold and the second manifold segments align to form the second common manifold, providing two fluid channels between endcaps. The chassis of at least two modules further have a first opening providing a fluid interface region between the first common manifold and a module specific flow path, and a second opening providing a fluid interface region between the module specific flow path and the second common manifold. The module specific flow path provides at least one fluid branch between the first common manifold and the second common manifold.
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公开(公告)号：US20240206136A1
公开(公告)日：2024-06-20
申请号：US18067041
申请日：2022-12-16
Applicant: BAE Systems Controls Inc.
Inventor： Stephen J. Kosteva , Cameron R. Vakili , Leslie R. Baker , Stephen L. Homan
IPC: H05K7/20
CPC classification number: H05K7/20927 , H05K7/20272
Abstract: A cooling system and method for cooling a contactor from the contactor-terminal side or both the contactor-mount side is provided. The contactors may be mounted to a base of a chassis. The cover may have one or more fluid channels associated with an exterior side of the cover. The interior side may have a plurality of thermally conductive bosses projecting from the interior surface configured to indirectly contact busbars which are respectively connected to contactor terminals of the contactors via thermal pads to provide a heat transfer path between the busbars and the fluid within the one or more fluid channels associated with the exterior side of the cover. Certain of the thermally conductive bosses are offset from the one or more fluid channels.
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公开(公告)号：US20240206135A1
公开(公告)日：2024-06-20
申请号：US18067025
申请日：2022-12-16
Applicant: BAE Systems Controls Inc.
Inventor： Stephen J. Kosteva , Cameron R. Vakili , Leslie R. Baker , Stephen L. Homan
CPC classification number: H05K7/20927 , H02M7/003 , H05K7/20272 , H05K7/20436
Abstract: A cooling system for a modular power control system (MPCS) is provided. The MPCS comprises modules. Each module has a chassis with a first manifold segment for first common manifold and a second manifold segment for second common manifold. When the modules are mounts to each other, the first manifold segments align to form the first common manifold and the second manifold segments align to form the second common manifold, providing two fluid channels between endcaps. The chassis of at least two modules further have a first opening providing a fluid interface region between the first common manifold and a module specific flow path, and a second opening providing a fluid interface region between the module specific flow path and the second common manifold. The module specific flow path provides at least one fluid branch between the first common manifold and the second common manifold.
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公开(公告)号：US20240204681A1
公开(公告)日：2024-06-20
申请号：US18067172
申请日：2022-12-16
Applicant: BAE Systems Controls Inc.
Inventor： Arthur P. Lyons , Stephen J. Kosteva , Cameron R. Vakili , Stephen L. Homan , Robert J. Vovos
CPC classification number: H02M7/003 , H02M1/088 , H05K7/14329
Abstract: A laminated DC busbar, a DC backplane and a DC busbar system with super low inductance is provided. Semiconductor switches may be connected to respective laminated DC busbars. The DC busbar system comprises a DC backplane and at least two laminated DC busbars respectively connected to semiconductor switches. The round-trip inductance between semiconductor switches connected to two adjacent laminated DC busbars via the DC backplane is less than about 7.5 nH
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