公开(公告)号：US20140206153A1

公开(公告)日：2014-07-24

申请号：US14224402

申请日：2014-03-25

Applicant: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.

Inventor： Thomas J. McIntyre ,  Keith K. Sturcken ,  Christy A. Hagerty

IPC: H01L21/48

CPC classification number: H01L21/4867 ,  B23K1/0016 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/642 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for fabricating an electronic device package having a column grid array is disclosed. A column grid array package includes a substrate, an integrated circuit located on a first side of the substrate, and a set of solder columns located on a second side of the substrate. The column grid array package also includes multiple two-tab electronic devices located on the second side of the substrate. The heights of the two-tab electronic devices are substantially identical to the heights of the solder columns.

公开(公告)号：US20130309815A1

公开(公告)日：2013-11-21

申请号：US13951502

申请日：2013-07-26

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： John A. Hughes ,  Christy A. Hagerty ,  Santos Nazario-Camacho ,  Keith K. Sturcken

IPC: H01L21/50

CPC classification number: H01L21/50 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/562 ,  H01L2224/13 ,  H01L2924/14

Abstract: An electronic device package includes a substrate and wire columns arranged in groups about a neutral stress point of the substrate. The height of the wire columns is substantially uniform for the plural groups of wire columns, and a length of at least one of the wire columns is greater than the uniform height. A method of fabricating an electronic device package having a column grid array includes applying two templates on wire columns of the column grid array and bending at least one wire column to increase its length while maintaining a uniform height for the column grid array. In another aspect, an electronic device package substrate includes wire columns having at least one non-uniformity in lengths of the columns, and the length of a wire column corresponds to a distance of that wire column from the neutral stress point of the substrate. The non-uniformity of length in the wire columns reduces stress in the package leads after attachment of the package to a carrier substrate, such as a printed circuit board.

Abstract translation: 一种电子器件封装，包括基板和布置成围绕基板的中性应力点组成的线柱。 线列的高度对于多组线柱而言基本上是均匀的，并且线柱中的至少一个的长度大于均匀的高度。 一种制造具有列栅格阵列的电子器件封装的方法，包括在列格栅阵列的线柱上施加两个模板，并弯曲至少一个线柱以增加其长度，同时保持柱格阵列的均匀高度。 在另一方面，一种电子器件封装衬底包括具有柱长度至少一个不均匀性的线柱，并且线柱的长度对应于该线柱与衬底的中性应力点的距离。 电线柱中的长度不均匀性降低了将封装件附接到诸如印刷电路板的载体衬底之后的封装引线中的应力。

公开(公告)号：US08586417B1

公开(公告)日：2013-11-19

申请号：US13951502

申请日：2013-07-26

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： John A. Hughes ,  Christy A. Hagerty ,  Santos Nazario-Camacho ,  Keith K. Sturcken

IPC: H01L23/49

CPC classification number: H01L21/50 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/562 ,  H01L2224/13 ,  H01L2924/14

Abstract: An electronic device package includes a substrate and wire columns arranged in groups about a neutral stress point of the substrate. The height of the wire columns is substantially uniform for the plural groups of wire columns, and a length of at least one of the wire columns is greater than the uniform height. A method of fabricating an electronic device package having a column grid array includes applying two templates on wire columns of the column grid array and bending at least one wire column to increase its length while maintaining a uniform height for the column grid array. In another aspect, an electronic device package substrate includes wire columns having at least one non-uniformity in lengths of the columns, and the length of a wire column corresponds to a distance of that wire column from the neutral stress point of the substrate. The non-uniformity of length in the wire columns reduces stress in the package leads after attachment of the package to a carrier substrate, such as a printed circuit board.