公开(公告)号：US09027226B2

公开(公告)日：2015-05-12

申请号：US13851804

申请日：2013-03-27

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： Murty S. Polavarapu ,  Nadim F. Haddad

IPC: H01S4/00 ,  H01R43/00 ,  H05K3/30 ,  H01L21/00 ,  H01G2/06 ,  H01L23/00 ,  H01G4/33

CPC classification number: H01G2/065 ,  H01G4/33 ,  H01L23/552 ,  H01L24/01 ,  H01L24/16 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2924/19011 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/4913

Abstract: A method for implementing a prompt dose mitigating capacitor is disclosed. Initially, a flip chip is provided with multiple capacitors. The flip chip is then placed on top of a substrate having multiple electronic devices connected to a set of power rails. The terminals of the capacitors within the flip chip are subsequently connected to the power rails within the substrate in order to regulate voltages appeared on the power rails during a radiation pulse.

Abstract translation: 公开了一种用于实施快速剂量减轻电容器的方法。 最初，倒装芯片设有多个电容器。 然后将倒装芯片放置在具有连接到一组电源轨的多个电子设备的基板的顶部上。 倒装芯片内的电容器的端子随后连接到基板内的电源轨，以便调节辐射脉冲期间电源轨上出现的电压。