公开(公告)号：US10079393B1

公开(公告)日：2018-09-18

申请号：US14592338

申请日：2015-01-08

Applicant: BLOOM ENERGY CORPORATION

Inventor： Avinash Verma ,  Ravi Oswal ,  Brandon Dawson ,  Brian Bollinger ,  Harald Herchen ,  Tad Armstrong

IPC: H01M8/02 ,  H01M8/0245 ,  B22F7/02 ,  B22F7/04 ,  B22F7/00 ,  B22F3/12 ,  B22F3/24 ,  B22F3/26 ,  B22F5/00 ,  B05D3/02 ,  H01M8/0202 ,  H01M8/12

CPC classification number: H01M8/0202 ,  B22F5/006 ,  B22F7/008 ,  B22F7/02 ,  B22F7/04 ,  B22F2003/248 ,  B22F2007/045 ,  B22F2998/10 ,  B22F2999/00 ,  C22C1/0408 ,  C22C1/0433 ,  C22C33/0207 ,  H01M8/0206 ,  H01M8/021 ,  H01M8/0217 ,  H01M8/0228 ,  H01M2008/1293 ,  B22F2201/03 ,  B22F1/0011 ,  B22F1/0096 ,  B22F3/02 ,  B22F3/10 ,  B22F7/062

Abstract: Methods for fabricating an interconnect for a fuel cell stack that include providing a protective layer over at least one surface of an interconnect formed by powder pressing pre-alloyed particles containing two or more metal elements and annealing the interconnect and the protective layer at elevated temperature to bond the protective layer to the at least one surface of the interconnect.