公开(公告)号：US20180108604A1

公开(公告)日：2018-04-19

申请号：US15538340

申请日：2016-05-16

申请人： BOE TECHNOLOGY GROUP CO., LTD.

发明人： Liqiang CHEN ,  Weifeng ZHOU ,  Wenyue FU ,  Huiji ZHOU

IPC分类号： H01L23/498 ,  H05K1/18

CPC分类号： H01L23/49838 ,  G09F9/30 ,  H01L23/49827 ,  H01L23/4985 ,  H01L2224/32225 ,  H05K1/118 ,  H05K1/189 ,  H05K2201/09227 ,  H05K2201/10128

摘要： Disclosed are a chip on film and a display device. the chip on film includes a plurality of output pads independent from each other extending in the first direction on a side of a base material; correspondingly, a flexible display panel in the display device includes a plurality of input pads in one-to-one correspondance with output pads extending in the first direction in the bonding region. The chip on film can improve the bonding yield and stability of the display device.