公开(公告)号：US20140125533A1

公开(公告)日：2014-05-08

申请号：US14068462

申请日：2013-10-31

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： SHIMING SHI ,  TAO SUN

IPC: H01Q1/22

CPC classification number: H01Q1/243 ,  H01Q1/38 ,  H01Q1/44 ,  Y10T29/49018

Abstract: A display panel comprises a first substrate and a second substrate which are arranged opposite to each other, and an antenna pattern is formed on the inside or the outside of the first substrate and includes a feed point and a ground point; the feed point is connected with a transceiver in a display device; and the ground point is connected with a ground wire of the transceiver.

Abstract translation: 显示面板包括彼此相对布置的第一基板和第二基板，并且天线图案形成在第一基板的内侧或外侧，并且包括馈电点和接地点; 馈电点与显示装置中的收发器连接; 并且接地点与收发器的接地线连接。

公开(公告)号：US20210135160A1

公开(公告)日：2021-05-06

申请号：US17146652

申请日：2021-01-12

Applicant: BOE Technology Group Co., Ltd.

Inventor： TAO SUN ,  Song Zhang ,  Tao Wang

IPC: H01L51/52 ,  H01L27/32 ,  H01L51/00 ,  H01L51/56

Abstract: The disclosure relates to a display panel, a method for fabricating the same, and a display device. The display panel includes: a base substrate including a first base substrate in a blind hole area and a second base substrate, the thickness of the first base substrate is smaller than the thickness of the second base substrate; an anode layer, a light-emitting layer, a cathode layer and an encapsulation layer arranged successively on the second base substrate, and the cathode layer and the encapsulation layer arranged successively on the first base substrate; wherein at least one installation hole is arranged in a display area of the display panel, the at least one installation hole is within the blind hole area and runs through the first base substrate and the respective layers on the first base substrate.

公开(公告)号：US20160359137A1

公开(公告)日：2016-12-08

申请号：US15031252

申请日：2015-09-18

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： LIQIANG CHEN ,  TAO SUN ,  BAOMING CAI

IPC: H01L51/52 ,  H01L25/00 ,  H01L51/56 ,  H01L25/16

CPC classification number: H01L51/5253 ,  H01L21/6835 ,  H01L21/77 ,  H01L23/544 ,  H01L25/167 ,  H01L25/50 ,  H01L27/3276 ,  H01L29/78603 ,  H01L51/524 ,  H01L51/56 ,  H01L2221/6835 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2227/326 ,  H01L2251/5338

Abstract: The present disclosure provides a method for bonding an integrated circuit (IC) chip onto a flexible display body. The method includes providing a substrate having a flexible display body thereon, and aligning a first stiffening component with the flexible display body having an IC bonding region. The method further includes attaching the first stiffening component onto a front surface of the flexible display body, and separating the substrate from the first stiffening component and the flexible display body to expose a back surface of the flexible display body; and bonding an IC chip onto the IC bonding region.

Abstract translation: 本公开提供了一种将集成电路（IC）芯片接合到柔性显示体上的方法。 该方法包括提供其上具有柔性显示体的基板，并且使第一加强部件与具有IC接合区域的柔性显示体对准。 该方法还包括将第一加强部件附接到柔性显示体的前表面上，以及将基板与第一加强部件和柔性显示体分离以露出柔性显示体的后表面; 并将IC芯片接合到IC接合区域上。