公开(公告)号：US20160359137A1

公开(公告)日：2016-12-08

申请号：US15031252

申请日：2015-09-18

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： LIQIANG CHEN ,  TAO SUN ,  BAOMING CAI

IPC: H01L51/52 ,  H01L25/00 ,  H01L51/56 ,  H01L25/16

CPC classification number: H01L51/5253 ,  H01L21/6835 ,  H01L21/77 ,  H01L23/544 ,  H01L25/167 ,  H01L25/50 ,  H01L27/3276 ,  H01L29/78603 ,  H01L51/524 ,  H01L51/56 ,  H01L2221/6835 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2227/326 ,  H01L2251/5338

Abstract: The present disclosure provides a method for bonding an integrated circuit (IC) chip onto a flexible display body. The method includes providing a substrate having a flexible display body thereon, and aligning a first stiffening component with the flexible display body having an IC bonding region. The method further includes attaching the first stiffening component onto a front surface of the flexible display body, and separating the substrate from the first stiffening component and the flexible display body to expose a back surface of the flexible display body; and bonding an IC chip onto the IC bonding region.

Abstract translation: 本公开提供了一种将集成电路（IC）芯片接合到柔性显示体上的方法。 该方法包括提供其上具有柔性显示体的基板，并且使第一加强部件与具有IC接合区域的柔性显示体对准。 该方法还包括将第一加强部件附接到柔性显示体的前表面上，以及将基板与第一加强部件和柔性显示体分离以露出柔性显示体的后表面; 并将IC芯片接合到IC接合区域上。

公开(公告)号：US20170271299A1

公开(公告)日：2017-09-21

申请号：US15305506

申请日：2015-10-29

Applicant: BOE TECHNOLOGY GROUP CO., LTD

Inventor： HONG LI ,  WEI HUANG ,  LIQIANG CHEN

IPC: H01L23/00 ,  H01L23/498 ,  H01L27/12

CPC classification number: H01L24/83 ,  G02F1/13452 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L27/124 ,  H01L27/3276 ,  H01L2224/16227 ,  H01L2224/29286 ,  H01L2224/2929 ,  H01L2224/29393 ,  H01L2224/29424 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29466 ,  H01L2224/29499 ,  H01L2224/32227 ,  H01L2224/73204 ,  H01L2224/81121 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/83874 ,  H01L2224/83887 ,  H01L2224/83907 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/01006 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0323 ,  H05K2203/105 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An anisotropic conductive film (ACF), a bonding structure, and a display panel, and their fabrication methods are provided. The ACF includes a resin gel and a plurality of conductive particles dispersed in the resin gel. The plurality of conductive particles is aligned and connected, in response to an electric field, to form a conduction path in the resin gel. The bonding structure includes the anisotropic conductive film (ACF) sandwiched between first and second substrates. The display panel includes the bonding structure.