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公开(公告)号：US20250076714A1
公开(公告)日：2025-03-06
申请号：US18580614
申请日：2022-05-18
Inventor： Wenqian LUO , Weibiao GENG , Xin GAI , Jingrui REN , Fanglin LI , Qian CHENG , Chunlei XIAO , Tianyang HAN
IPC: G02F1/1345 , G09G3/36 , H05K1/18
Abstract: A display module includes a display panel, a driving circuit board, a flexible printed circuit and a driving chip. The driving circuit board includes a circuit board body and at least one bonding component. The circuit board body has a first main surface and a second main surface opposite to each other. A bonding component is located on the first main surface. The circuit board body is provided with at least one receiving structure therein. A receiving structure has at least an opening in the first main surface. The driving chip is installed on the flexible printed circuit, and is located on a side of the flexible printed circuit proximate to the driving circuit board. An orthographic projection of the driving chip on a first reference plane is located inside an orthographic projection of the opening on the first reference plane.
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公开(公告)号：US20210091057A1
公开(公告)日：2021-03-25
申请号：US17010575
申请日：2020-09-02
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Zhiwei LIANG , Wenqian LUO , Guoqiang WANG , Yingwei LIU
Abstract: The present disclosure provides a driving substrate and a manufacturing method thereof, and a micro LED bonding method. The driving substrate includes: a base substrate; a driving function layer provided on the base substrate, and including a plurality of driving thin film transistors and a plurality of common electrode lines; a pad layer including a plurality of pads provided on a side of the driving function layer away from the base substrate, each pad including a pad body and a microstructure of hard conductive material provided on a side of the pad body away from the base substrate; and a plurality of buffer structures provided on the side of the driving function layer away from the base substrate, each buffer structure surrounding a portion of a corresponding microstructure close to the base substrate, and a height of the buffer structure being lower than a height of the microstructure.
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公开(公告)号：US20210036196A1
公开(公告)日：2021-02-04
申请号：US16920401
申请日：2020-07-02
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhiwei LIANG , Wenqian LUO , Yingwei LIU , Ke WANG , Shengguang BAN , Zhanfeng CAO
Abstract: A preparation method of a backplane includes: forming an insulating structure layer having a groove on a base substrate by a mask exposure process, the groove being used for accommodating a metal trace; and repeating a metal sub-layer forming step including an ashing process and a wet etching process multiple times to form the metal trace positioned in the groove.
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公开(公告)号：US20240219760A1
公开(公告)日：2024-07-04
申请号：US18558102
申请日：2022-04-02
Inventor： Wenqian LUO , Hetao WANG , Zhanchang BU , Yuanye CHEN , Peng LI , Weibiao GENG , Chunlei XIAO , Qian CHENG , Fanglin LI , Tianyi FENG , Tianyang HAN
IPC: G02F1/1333 , A61B1/00 , F21V8/00
CPC classification number: G02F1/133317 , A61B1/00048 , G02B6/0085 , G02F1/133331 , G02F2202/28
Abstract: A display device and a medical endoscopic apparatus are provided. The display device includes: a display panel; a cover plate at a light exit side of the display panel; a backlight module, at a side of the display panel away from the cover plate; a middle frame, including: a first part, configured to support the display panel; a second part, connected with the first part and extends from the first part to the side away from the cover plate; the second part is around the backlight module at side of the backlight module; the display device includes a first space between the first part and the cover plate, a first side of the first space is limited by the cover plate, a second side of the first space is limited by the first part, the first side is opposite to the second side of the first space.
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Patent Agency Ranking
公开(公告)号：US20210225901A1
公开(公告)日：2021-07-22
申请号：US17059501
申请日：2020-03-11
Inventor： Wenqian LUO , Xiang LI , Zhanchang BU
Abstract: The manufacturing method of the driving backplane includes following steps. A first flexible base is formed on a surface of a rigid substrate. At least one type of conductive pattern is formed on a surface of the first flexible base. At least one type of first via is provided in the rigid substrate. At least one type of second via is provided in the first flexible base by using the rigid substrate as a mask and a conductive pillar is formed in the at least one type of second via, so that the conductive pillars are connected to respective types of conductive pattern in one-to-one correspondence. At least one type of driving chip is correspondingly bonded to the conductive pillar formed in the at least one type of second via from a side of the first flexible base away from the at least one type of conductive pattern.
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公开(公告)号：US20250110564A1
公开(公告)日：2025-04-03
申请号：US18729183
申请日：2023-05-12
Inventor： Wenqian LUO , Jingrui REN , Xin GAI , Yuan JIA , Yujia ZHANG , Tianyi FENG , Weibiao GENG , Fanglin LI
Abstract: Disclosed is a display module comprising a timing controller which comprises an identification unit and a determination unit, wherein the identification unit is configured to receive and identify a control signal sent by the display controller and output a first feedback signal to the display controller when the control signal is identified as a handshake signal, the first feedback signal being used for triggering the display controller to send a handshake parameter; and the determination unit is connected to the display controller, and is configured to receive the handshake parameter sent by the display controller, determine whether the handshake parameter matches a handshake parameter pre-stored in the determination unit, if so, determine that handshake is successful, and output a second feedback signal to the display controller, the second feedback signal being used for triggering the display controller to send a video signal, and if not, determine that handshake fails.
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公开(公告)号：US20230131247A1
公开(公告)日：2023-04-27
申请号：US17043937
申请日：2019-10-31
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Zhiwei LIANG , Wenqian LUO , Zhijun LV , Yingwei LIU , Ke WANG , Zhanfeng CAO
Abstract: The present disclosure provides a supporting substrate, including: a base substrate and a plurality of connecting electrodes provided on the base substrate, wherein a clamping electrode is provided on a side of at least one of the connecting electrodes facing away the base substrate, the clamping electrode is electrically connected with a corresponding connecting electrode and configured to be capable of clamping and fixing an electrode pin of the micro-light emitting device. The present disclosure also provides a manufacturing method for the supporting substrate, and a backplane.
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公开(公告)号：US20210098646A1
公开(公告)日：2021-04-01
申请号：US16855351
申请日：2020-04-22
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Zhiwei LIANG , Wenqian LUO , Shibo JIAO , Feng WANG , Yingwei LIU
IPC: H01L33/00 , H01L25/075 , H01L33/62
Abstract: The present disclosure provides a detection device for Micro-LED and a method manufacturing thereof, and a detection apparatus for Micro-LED, and the detection device for Micro-LED comprises: a substrate, and a first via and a second via penetrating through the substrate; the substrate comprises a first surface and a second surface which are opposite to each other; the first via and the second via are respectively arranged corresponding to a first pole and a second pole of a Micro-LED to be detected, and the detection device for Micro-LED further comprises: a first detection component and a second detection component on the first surface of the substrate.
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公开(公告)号：US20210043817A1
公开(公告)日：2021-02-11
申请号：US16917921
申请日：2020-07-01
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhiwei LIANG , Wenqian LUO , Yingwei LIU , Zhanfeng CAO , Ke WANG
Abstract: A display substrate includes a drive substrate and a welding pad provided on the drive substrate and electrically connected with the drive substrate. The display substrate further includes an insulating construction layer provided on the welding pad. The insulating construction layer is provided with a groove for exposing the welding pad. A bonding material is accommodated in the groove, and a micro light emitting diode is electrically connected with the welding pad through the bonding material.
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